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Specification
Brand : Yechiry
BulletPoint1 : POSITIONING : Positioning Planting Template can be precisely positioned for fast tinning and the ball template does not change at high temperatures.
BulletPoint2 : MULTIPLE SPACING : Reballing Template has three hole spacing (0.3 0.35 0.4 0.5), four spacing and multiple sizes, which can meet your multiple needs.
BulletPoint3 : VERSATILE : Universal BGA Reballing Stencil is versatile enough to be applied to the common integrated circuits found in today's cell phones to meet your every need.
BulletPoint4 : MATERIAL : BGA Reballing Stencil is made of stainless steel material, which is not easy to be damaged and has a long service life.
BulletPoint5 : COMPACT APPEARANCE : BGA Reballing Stencil for Phone compact appearance makes it easy to carry and use, and it doesn't take up much space when you store it, making it more convenient for you to use.
BulletPoint6 : Apply Battery Type：Copper sheet, 18650, 21700, 26650, 32650 battery, LFP aluminum/copper electrode
Color : Black
ExternallyAssignedProductIdentifier : 7651020595910
IncludedComponents : Welding machine，Pedal switch，75A open-end wrench
ItemName : BGA Reballing Stencil - BGA Reballing Stencil for Phone IC Chips Repairing
ItemPackageDimensions_Height : 1 centimeters
ItemPackageDimensions_Length : 10 centimeters
ItemPackageDimensions_Width : 10 centimeters
ItemTypeKeyword : spot-welding-equipment
Manufacturer : Yechiry
ModelName : Yechiryy98qarizpv
ModelNumber : Yechiryy98qarizpv
NumberOfItems : 1
PartNumber : Yechiryy98qarizpv
PowerSourceType : ac_dc
ProductDescription : 1. FOUR PITCHES: Universal BGA reballing stencil has three types of holes with 0.3 0.35 0.4 0.5 pitch, four kinds of spacing and multiple sizes.
2. POSITIONING: Tin mesh solder template is precisely positioned for fast tin implantation, and the ball template will not change under high temperature.
3. COMPACT APPEARANCE: Universal BGA reballing stencil has a compact appearance and is easy to carry around and use.
4. VERSATILE: BGA reballing stencil is versatile and suitable for the common IC used in cell phones today, which can meet your various needs.
5. STAINLESS STEEL MATERIAL: Tin mesh solder template is made of premium stainless steel material, which is not easily damaged and has a long service life.

Specification:
Item Type: BGA Reballing Stencil
Pitch: 0.3mm/0.012in, 0.35mm/0.014in, 0.4/0.016in, 0.5mm/0.020in
Product Material: Stainless Steel

PackageList:
1 xBGA Reballing Stencil
ProductSiteLaunchDate : 2024-08-05T14:26:09.653Z
Size : Standard
SupplierDeclaredDgHzRegulation : unknown
SupplierDeclaredHasProductIdentifierExemption : 1
UnitCount : 1