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Specification
Brand : Pongnas
BulletPoint1 : [Heat,resistant Design] The stencils can withstand hot air machine heating without deformation, allowing for precise and reballing.
BulletPoint2 : [Easy Selection] Each stencil is marked with specifications on the surface, providing convenient guidance for choosing the right one for the job.
BulletPoint3 : [Multiple Applications] Specifically designed for laptop, desktop, communication main board north,south bridge, and graphics card bga chips, these stencils are versatile and essential for bga rework projects.
BulletPoint4 : [Versatile Sizes] With 5 different sizes and a total of 33 pieces, these stencils cater to various needs, making them ideal for laptop, desktop, and graphics card bga chips.
BulletPoint5 : [ Material] These stencils are crafted from premium 304 stainless steel, ensuring durability and thickness for efficient reballing.
ItemName : 33pcs BGA Universal Reballing Rework Net Stencils Steel Mesh Set Kit, Stainless Steel, Laptop, Desktop, Graphics Card
ItemPackageDimensions_Height : 2 centimeters
ItemPackageDimensions_Length : 6 centimeters
ItemPackageDimensions_Width : 6 centimeters
ItemTypeKeyword : spot-welding-equipment
Manufacturer : Pongnas
ModelName : Pongnasb67w4c32eq
ModelNumber : Pongnasb67w4c32eq
PartNumber : Pongnasb67w4c32eq
ProductDescription : [Heat,resistant Design] The stencils can withstand hot air machine heating without deformation, allowing for precise and reballing.
[Easy Selection] Each stencil is marked with specifications on the surface, providing convenient guidance for choosing the right one for the job.
[Multiple Applications] Specifically designed for laptop, desktop, communication main board north,south bridge, and graphics card bga chips, these stencils are versatile and essential for bga rework projects.
[Versatile Sizes] With 5 different sizes and a total of 33 pieces, these stencils cater to various needs, making them ideal for laptop, desktop, and graphics card bga chips.
[ Material] These stencils are crafted from premium 304 stainless steel, ensuring durability and thickness for efficient reballing.

Spec:

These stencils were made by material, can be heated by the hot air machine, it is easy and quickly for reballing the BGA IC.
Features:
These stencils are made of stainless steel, the thickness of steel mesh is .
They can be heated by the hot air machine, these stencils are not easy to deform when heated.
There are 5 different sizes and totally 33pcs, enough to meet your various needs.
The specifications are marked on the surface, convenient for you to choose.
It is specially designed for laptop, desktop, communication main board north,south bridge, and graphics card, etc all kinds of BGA chips.
Specification:
Material: Stainless Steel
Color: Silver
Quantity: 33pcs
Weight: Approx. 61g / 2.2oz
Package List:
2pcs x BGA Stencils for 0.35mm Solder Ball
1pcs x BGA Stencils for 0.4mm Solder Ball
14pcs x BGA Stencils for 0.5mm Solder Ball
13pcs x BGA Stencils for 0.6mm Solder Ball
3pcs x BGA Stencils for 0.76mm Solder Ball




ProductSiteLaunchDate : 2024-09-29T12:06:08.081Z
UnspscCode : 44111800