Specification Brand : Hilitand BulletPoint1 : Specification: Item type: BGA Reballing Stencil; Pitch: 0.3mm/0.012in, 0.35mm/0.014in, 0.4/0.016in, 0.5mm/0.020in; Product material: Stainless Steel. BulletPoint2 : The tin mesh solder template is made of premium stainless steel material, which is not easily damaged and good durability for long use. BulletPoint3 : The tin planting template comes with a light weight and a compact size as well, the convenient installation can be quickly finished in minutes, and easy to carry around and use. BulletPoint4 : The IC chips repair accessories is versatile and suitable for the common IC used in cell phones today, which can meet your various needs. BulletPoint5 : The tin mesh solder template is precisely positioned for fast tin implantation, and the ball template will not change under high temperature, and it can improve performance and reliability. CustomerPackageType : Standard Packaging ExternallyAssignedProductIdentifier1 : 755835984192 ExternallyAssignedProductIdentifier2 : 0755835984192 FinishType : Finish HeatingElementType : Ceramic IncludedComponents : tool box ItemName : Universal BGA Reballing Stencil, Tin Mesh Solder Planting Template, IC Chips Repair Accessories for Phone IC Chips Repair ItemPackageDimensions_Height : 15.24 centimeters ItemPackageDimensions_Length : 0.0254 centimeters ItemPackageDimensions_Width : 11.43 centimeters ItemPackageQuantity : 1 ItemTypeKeyword : soldering-stations Manufacturer : Hilitand Material : stainless_steel ModelName : Hilitanducin65e2bs ModelNumber : Hilitanducin65e2bs NumberOfItems : 1 PartNumber : Hilitanducin65e2bs PowerSourceType : PowerSource ProductDescription : Specification: Item Type: BGAReballingStencil Pitch: 0.3mm/0.012in, 0.35mm/0.014in, 0.4/0.016in, 0.5mm/0.020in Product Material: Stainless Steel