Applications: 1. Unsoldering multiple components, such as SOIC ,CHIP, QFP, PLCC, BGA and temperature-sensitive components(especially for flat cables and cable connectors) ; 2. Applicable to thermal shrinkage, drying, painting removal, adhesive removal, thawing, preheating and plastic soldering.
Packing List: 1 x 8586D Rework Station 1 x Hot Air Gun 1 x Soldering Iron 1 x Stand with sponge 1 x US Power Cable 1 x Holder 3 x Hot Air Nozzles(5mm,8mm,10mm) 5 x Soldering Iron Tips(K/B/I/2.4D/3C) 1 x Desoldering pump 1 x Solder Wick CP-2015 1 x Solder wire Tube 1 x Spare Heating Element for Hot Air Gun 1 X Spare Heating Element for Soldering Iron 1 x Straight Tweezers ESD-12 1 x Curved Tweezers ESD-15 1 x IC Puller 1 x Manual