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Specification
Brand : Hilitand
BulletPoint1 : [HIGH PRECISION REBALLING]: Application chip for min/ clamping chip sizes from 9mm to 43mm. Adjust chip size knob for easy tin bead removal.
BulletPoint2 : [WIDE COMPATIBILITY]: Ideal for laptop CPUs, mobile phones, and digital products. for BGA manual welding rework.
BulletPoint3 : [EASY TO USE]: Features a diversion groove for excess tin bead pouring. The HT-90 90x90 model ensures a precise and efficient process.
BulletPoint4 : [DURABLE MATERIAL]: Constructed with aluminum alloy, providing a light yet durable reballing station for long-term use.
BulletPoint5 : [PORTABLE DESIGN]: Compact and lightweight design makes this station easy to transport and use anywhere you need for reballing tasks.
IncludedComponents : No
ItemName : HT-90 90x90 BGA Reballing Station with Universal Stencil, Aluminum Alloy Rework Kit for Laptop CPU and Mobile Phone Digital Products Plant Tin Rework, Soldering Stations
ItemPackageDimensions_Height : 7 centimeters
ItemPackageDimensions_Length : 15 centimeters
ItemPackageDimensions_Width : 15 centimeters
ItemTypeKeyword : soldering-stations
Manufacturer : Hilitand
ModelName : Hilitandu8n7t3b4if
ModelNumber : Hilitandu8n7t3b4if
PartNumber : ZKEOOIVA1t2f6sg3ve
PowerSourceType : AC/DC
ProductDescription : 1. This reballing station adopt aluminum alloy material as structure, light and durable
2. This product is a BGA universal diagonal ball planting fixture with all aluminium alloy plating
3. Not easy to oxidize, more wear‑resistant, and more suitable for 9mm to 43mm BGA chip ball planting
4. Adjust the chip size knob and set the diversion groove to facilitate the pour out of excess tin beads
5. Used for laptop CPU, mobile phone digital products plant tin rework with BGA manual welding

Spec:
Item Type: BGA Reballing Station
Product Model: HT-90 90x90
Applicable Steel Mesh: Approx. 90 x 90mm / 3.5 x 3.5in
Application Chip: Minimum clamping chip: approx. 9 x 9mm / 0.4 x 0.4in, maximum clamping chip: approx. 43 x 43mm / 1.7 x 1.7in
Material: Aluminum alloy
Application: BGA manual soldering for plant tin rework of notebook computer CPU and mobile phone digital products.

Package List:
1 x BGA Reballing Station
1 x Hex Wrench
ProductSiteLaunchDate : 2025-04-24T05:15:58.023Z
SupplierDeclaredDgHzRegulation : not_applicable
SupplierDeclaredHasProductIdentifierExemption : 1
UnitCount : 1
UnspscCode : 23271800