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Specification
Brand : DIYPHONE
BulletPoint1 : ⛄【Planting Tin Steel Mesh 】BGA Reballing Stencil Design For Huawei Series Phone CPU IC Chip Repair ,0.12mm thickness.BGA stencil is versatile and suitable for the common IC used in cell phones today, which can meet your various needs.
BulletPoint2 : ♔【BGA Reballing Stencil Material】The tin mesh solder template is made of premium stainless steel material, which is not easily damaged and good durability for long use.Crafted for durability, this stencil withstands high temperatures, ensuring reliable BGA reballing.
BulletPoint3 : ✨【Template Mesh Directly Heat】Template Mesh Directly Heat Multi-purpose BGA Reballing Stencils Make your repair work easier.these stencils are not easy to deform when heated.
BulletPoint4 : ⏰【Precise Positioning】Tin mesh solder template is precisely positioned for fast tin implantation, and the ball template will not change under high temperature.
BulletPoint5 : ✽ 【Easy To Use】The stencil has a compact appearance and is easy to carry around and use.The BGA Rework Net is easy and quickly for reballing the BGA IC, useful and economical accessories for BGA soldering.
Color : silvery
ExternallyAssignedProductIdentifier1 : 0686585485465
ExternallyAssignedProductIdentifier2 : 686585485465
IncludedComponents : Bag
ItemDisplayDimensions_Height : 1.77 inches
ItemDisplayDimensions_Length : 15.75 inches
ItemDisplayDimensions_Width : 1.97 inches
ItemDisplayWeight : 0.45 pounds
ItemName : DIYPHONE BGA Reballing Stencils Kit，18 Pcs Planting Tin Steel Mesh，Solder Tin Planting Template,Square Hole Direct Heating Planting Tin Net for Huawei Series Phone CPU IC Chip Repair
ItemPackageDimensions_Height : 8 centimeters
ItemPackageDimensions_Length : 13 centimeters
ItemPackageDimensions_Width : 12 centimeters
ItemTypeKeyword : soldering-stations
Manufacturer : DIYPHONE
Material : Stainless Steel
ModelName : Planting Tin Steel Mesh
ModelNumber : Universal BGA Reballing Stencil Kit
NumberOfItems : 18
PartNumber : HW-021-HW1-HW18 -18pcs
PowerSourceType : ac/dc
ProductDescription : DIYPHONE BGA Reballing Stencils Kit，18 Pcs Planting Tin Steel Mesh，Solder Tin Planting Template ,Square Hole Direct Heating Planting Tin Net for Huawei Series Phone CPU IC Chip Repair
ProductSiteLaunchDate : 2025-03-25T07:00:00.000Z
Size : 40.00X5.00X4.50CM
Style : Square Hole Reballing Stencil
SupplierDeclaredDgHzRegulation : not_applicable
UnitCount : 1
UnspscCode : 44111800