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Specification
Brand : MAVIS LAVEN
BulletPoint : Worthington Cylinders
BulletPoint1 : [HIGHLY AND LASTING] Crafted from premium stainless steel, this tin mesh solder template ensures longevity and resilience to repeated use, guaranteeing durability and reliability.
BulletPoint2 : [VERSATILE REPAIR TOOL] Ideal for repairing common ICs found in modern cell phones, this BGA reballing stencil offers versatility to address a wide range of repair needs effectively.
BulletPoint3 : [FLEXIBLE HOLE SIZES] With multiple hole sizes and four spacing options, this universal BGA reballing stencil caters to diverse IC chip repair requirements, providing flexibility and .
BulletPoint4 : [COMPACT PORTABLE DESIGN] Featuring a compact and portable design, this universal BGA reballing stencil is convenient to carry and use whenever necessary, ensuring ease of use and storage.
BulletPoint5 : [PRECISE TIN IMPLANTATION] Engineered for accurate and rapid tin implantation, this tin mesh solder template maintains precise positioning even under high temperatures, facilitating efficient repair work.
BulletPoint6 : SPECIFICATIONS: Weight: 10lbs/Diameter: .035''(0.9mm)
Color : B
Department : unisex-adult
ExternallyAssignedProductIdentifier1 : 658848701834
ExternallyAssignedProductIdentifier2 : 0658848701834
FinishType : Aluminum
GpsrSafetyAttestation : 1
ImportDesignation : Made in the USA
IncludedComponents : No
ItemName : BGA Reballing Stencil, Versatile Tin Mesh Solder Template for Common ICs Repair, Multiple Hole Sizes, Compact and Portable, Precisely Positioned
ItemPackageDimensions_Height : 1 centimeters
ItemPackageDimensions_Length : 10 centimeters
ItemPackageDimensions_Width : 10 centimeters
ItemPackageQuantity : 1
ItemShape : Round
ItemTypeKeyword : soldering-stations
Manufacturer : MAVIS LAVEN
Material : 10 LB
ModelName : Mavis Lavenisqcgwk9rm
ModelNumber : MAVIS LAVENisqcgwk9rm
NumberOfBoxes : 1
NumberOfItems : 1
PackageLevel : unit
PartNumber : MAVIS LAVENisqcgwk9rm
PowerSourceType : ac/dc
ProductDescription : [HIGHLY AND LASTING] Crafted from premium stainless steel, this tin mesh solder template ensures longevity and resilience to repeated use, guaranteeing durability and reliability. [VERSATILE REPAIR TOOL] Ideal for repairing common ICs found in modern cell phones, this BGA reballing stencil offers versatility to address a wide range of repair needs effectively. [FLEXIBLE HOLE SIZES] With multiple hole sizes and four spacing options, this universal BGA reballing stencil caters to diverse IC chip repair requirements, providing flexibility and . [COMPACT PORTABLE DESIGN] Featuring a compact and portable design, this universal BGA reballing stencil is convenient to carry and use whenever necessary, ensuring ease of use and storage. [PRECISE TIN IMPLANTATION] Engineered for accurate and rapid tin implantation, this tin mesh solder template maintains precise positioning even under high temperatures, facilitating efficient repair work. 1. FOUR PITCHES: Universal BGA reballing stencil has three types of holes with 0.3 0.35 0.4 0.5 pitch, four kinds of spacing and multiple sizes.
2. PRECISE POSITIONING: Tin mesh solder template is precisely positioned for fast tin implantation, and the ball template will not change under high temperature.
3. COMPACT APPEARANCE: Universal BGA reballing stencil has a compact appearance and is easy to carry around and use.
4. VERSATILE: BGA reballing stencil is versatile and suitable for the common IC used in cell phones today, which can meet your various needs.
5. STAINLESS STEEL MATERIAL: Tin mesh solder template is made of premium stainless steel material, which is not easily damaged and has a long service life.

Spec:
Item Type: BGA Reballing Stencil
Pitch: 0.3mm/0.012in, 0.35mm/0.014in, 0.4/0.016in, 0.5mm/0.020in
Product Material: Stainless Steel

PackageList:
1 xBGA Reballing Stencil
1 x
BGA Reballing Stencil
ProductSiteLaunchDate : 2025-02-26T17:26:30.293Z
Size : as described
Style : 10 LB
SupplierDeclaredDgHzRegulation : not_applicable
UnitCount : 1
UnspscCode : 53120000
WarrantyDescription : Warranty