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Specification
Brand : WOHPNLE
BulletPoint1 : Multiple Pitches: This BGA reballing stencil features hole sizes in 0.3mm, 0.35mm, 0.4mm, and 0.5mm pitch configurations. This BGA reballing stencil is ideal for a wide range of integrated circuits commonly found in smartphones and electronic devices, providing a single tool for diverse soldering and rework needs.
BulletPoint2 : Precise Alignment: Designed for accuracy, this tin solder template provides stable positioning for fast and clean solder ball placement. Even under high temperatures, the stencil maintains shape, allowing precise alignment without warping or misplacement during heating.
BulletPoint3 : Compact and Portable: The universal BGA reballing stencil is compact and lightweight, making this stencil a practical addition to your mobile repair kit or workspace. The universal BGA reballing stencil is easy to carry for on-site repairs and fits conveniently into tool organizers without taking up space.
BulletPoint4 : Compatiblility: This IC reballing stencil is designed to fit the soldering requirements of various chips used in modern smartphones. Whether you’re repairing iOS or Android devices, this stencil supports the majority of standard IC sizes and layouts for chip reballing and maintenance.
BulletPoint5 : Stainless Steel Material: Made from premium stainless steel, this reballing stencil resists deformation and damage from repeated heat exposure. Lasting structure offers extended service life, providing reliability during frequent soldering sessions and high-temperature reflow processes.
Color : Silver
ExternallyAssignedProductIdentifier : 7701251843295
ExternallyAssignedProductIdentifier1 : 0662211130541
ExternallyAssignedProductIdentifier2 : 662211130541
IncludedComponents : No
ItemName : BGA Reballing Stencil, Precise Alignment Tin Solder Template Compact and Portable IC Reballing Stencil for Mobile Phone Motherboard Maintenance and Rework Tasks
ItemPackageDimensions_Height : 1 centimeters
ItemPackageDimensions_Length : 10 centimeters
ItemPackageDimensions_Width : 10 centimeters
ItemTypeKeyword : soldering-stations
Manufacturer : WOHPNLE
Material : Metal
ModelName : WOHPNLEcfg0met4ad
ModelNumber : WOHPNLEcfg0met4ad
NumberOfItems : 1
PartNumber : WOHPNLEcfg0met4ad
PowerSourceType : ac/dc
ProductDescription : Product Description:
This stainless steel BGA reballing stencil includes multiple pitches (0.3mm–0.5mm) for IC chip repair and tin ball implantation. Compact and heat-proof, this stainless steel BGA reballing stencil is ideal for mobile phone motherboard maintenance and rework tasks.

Item Type: BGA Reballing Stencil
Pitch: 0.3mm/0.012in, 0.35mm/0.014in, 0.4/0.016in, 0.5mm/0.020in
Product Material: Stainless Steel

Package List：
1 x BGA Reballing Stencil

ProductSiteLaunchDate : 2025-04-22T12:27:36.117Z
Size : 120x71x17MM
SupplierDeclaredDgHzRegulation : not_applicable
SupplierDeclaredHasProductIdentifierExemption : 1
UnitCount : 1
UnspscCode : 23271800