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Specification
Brand : Midzoo
BulletPoint : Paste NC-559-ASM 100g Leaded Free Soldering Flux Welding Paste BGA PCB SMT IC Reballing Soldering Paste Flux Grease
BulletPoint1 : It is a high-viscosity no-clean flux that can be used for rework, ball or pin connection to BGA, CGA and CSP packages, and assembly operations such as flip chip connection to PWB substrates.
BulletPoint2 : Suitable for welding computer north-south bridge, graphics card, mobile phone chip, video chip
BulletPoint3 : Less residue, bright welding, less smoke, no irritating odor, and will not run the ball.
BulletPoint4 : A good formula for BGA reballing/ball can make the ball stick more.
BulletPoint5 : Tested before shipment;
ExternallyAssignedProductIdentifier : 4862440116934
ItemName : Paste NC-559-ASM 100g Leaded Free Soldering Flux Welding Paste BGA PCB SMT IC Reballing Soldering Paste Flux Grease
ItemPackageQuantity : 1
ItemTypeKeyword : solder-flux
Manufacturer : Midzoo
Material : lead
NumberOfItems : 1
PartNumber : MiMODULE-12351
ProductDescription :
Introduction:
Rework help paste applied to mobile phone PCB, BGA and SMD's PGA etc.
It's used in low ionic activator system, tin-run speed
Low level of smoke,surface insulation resistance value is high residue after curing
Therefore, the electrical properties of the cell phones and other communications products, very little interference
Features:
NC-559 as a leave-in help paste residue color is very light, there is a very high value of SIR
Recommended for BGA, CSP and other solder ball array repair and fill the ball
When using smoke less, no residue. Affordable.
Suitable for:
North and south bridge, cards, cell phone chip, video chip BGA solder, bumping
Also can use off the tin, the effect is very ideal
The residue was less bright spot, less smoke, no pungent odor, do not run the ball
Package included:
1 x 100g NC-559-ASM BGA PCB SMT IC Reballing Soldering Paste Flux Grease
8096
HIGH QUALITY
ProductSiteLaunchDate : 2021-06-27T16:34:31.161Z