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Specification
Brand : Flbirret
BulletPoint1 : HIGH TEMPERATURE SOLDER PASTE: Sn96.5, Ag3, and Cu0.5 composition with a melting point of 217℃ for versatile mobile phone repair.
BulletPoint2 : NO CLEAN FLUX: Easy to use solder paste that eliminates the need for cleaning flux, saving time and effort.
BulletPoint3 : MULTIPLE APPLICATIONS: Ideal for mobile phone, hard disk, CPU, and IC maintenance, offering practicality and convenience.
BulletPoint4 : CONTROLLED & ACCURATE WELDING: Provides precise and efficient welding, increasing productivity and speeding up the repair process.
BulletPoint5 : HIGH EFFICIENCY: Boosts efficiency in soldering tasks, ensuring quick and reliable results for professional phone repair technicians.
FinishType : Finish
IncludedComponents : inc
ItemName : No Clean Solder Paste High Temperature Soldering Flux Cream for Mobile Phone Repair SFD 226 Solder Paste Soldering Flux Paste High Temperature
ItemPackageQuantity : 1
ItemTypeKeyword : solder-flux
Manufacturer : Flbirret
Material : Material
PartNumber : Flbirretn647myzrxs
PowerSourceType : PowerSource
ProductDescription : Brand: SFD‑226
Keywords: No Clean Solder Paste High Temperature Soldering Flux Cream for Mobile Phone Repair SFD‑226 Solder Paste Soldering Flux Paste No Clean Soldering Paste High Temperature Solder Paste Solder Cream Phone Repair Solder Paste
Title: SFD‑226 No Clean Solder Paste High Temperature Soldering Flux Cream for Mobile Phone Repair: Efficient and Accurate Soldering Solution
Description:
Introducing the SFD‑226 No Clean Solder Paste High Temperature Soldering Flux Cream, the ultimate solution for all your mobile phone repair needs. This high-quality solder paste is designed to provide efficient and accurate soldering, ensuring a seamless repair process every time.
1. PASTE COMPOSITION: The solder paste is composed of Sn96.5, Ag3, and Cu0.5, with 20‑38um (No. 4 powder) particles. This unique composition guarantees excellent soldering results, making it ideal for delicate mobile phone repairs.
2. HIGH MELTING POINT: With a melting point of 217℃, this high temperature soldering flux paste is perfect for various maintenance situations. It can withstand high temperatures, ensuring a reliable and durable solder joint.
3. NO NEED TO CLEAN: Say goodbye to the hassle of cleaning flux after soldering. 

Specification:
Item Type: Solder Paste
Model: SFD-226
Composition: Sn96.5, Ag3, Cu0.5
Granules: 20-38um (No. 4 powder)
Applicable: Used to repair mobile phone, hard disk, CPU, IC, etc.
Melting Point: 217℃

Package List:
1 x Solder Paste
ProductSiteLaunchDate : 2023-09-03T05:06:16.484Z
UnspscCode : 23271800