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Specification
Brand : HELYZQ
BulletPoint : Pack of 3 bottles
BulletPoint1 : It has high strength and fast bonding effect.
BulletPoint2 : Used to paste heat sink with IC chips,and be cooling body with good thermal effect.
BulletPoint3 : It is a one-component room temperature vulcanized silica gel with good thermal conductivity and insulation. It has good conductivity, wide temperature range (-60~200°C) and short-term resistance to 300°C.
BulletPoint4 : In addition, it has short surface curing time, strong bonding force, long storage period, non-toxic, solvent-free.
BulletPoint5 : It can be safely applied in the elastic bonding, heat dissipation, insulation and packaging of electronics, electrical appliances, instruments, LEDs, heat sinks and other industries.
Color : As Shown
ExternallyAssignedProductIdentifier : 7445830190669
ExternallyAssignedProductIdentifier1 : 0369251634502
ExternallyAssignedProductIdentifier2 : 369251634502
FinishType : Finish
IncludedComponents : inc
ItemDisplayDimensions_Height : 5 meters
ItemDisplayDimensions_Length : 5 meters
ItemDisplayDimensions_Width : 5 meters
ItemName : HELYZQ Thermal Silicone Adhesive Compound Glue Conductive Heatsink Plaster for Electronic CPU GPU
ItemPackageDimensions_Height : 3 centimeters
ItemPackageDimensions_Length : 7 centimeters
ItemPackageDimensions_Width : 7 centimeters
ItemPackageQuantity : 1
ItemTypeKeyword : solder-flux
Manufacturer : HELYZQ
Material : Silicone
ModelNumber : 98120
PartNumber : HELYZQ
PowerSourceType : PowerSource
ProductDescription : 100percent brand new and high quality Features: It has high strength and fast bonding effect. Used to paste heat sink with IC chips,and be cooling body with good thermal effect. It is a one-component room temperature vulcanized silica gel with good thermal conductivity and insulation. It has good conductivity, wide temperature range (-60 200degree C) and short-term resistance to 300degree C. In addition, it has short surface curing time, strong bonding force, long storage period, non-toxic, solvent-free. Instructions: 1. When using, directly extrude the product, rub the surface of the adherend, and cover it immediately after use, in case of trial again; 2. The surface fixed speed is related to the relative humidity and temperature in the air; the higher the temperature, the faster the curing speed, and vice versa; 3. the recommended thickness of the application: 0.1-0.5mm, the thinner the better. 4. Please clean the surface of the bonded object before use (such as alcohol), avoid cleaning with detergent, and apply it after the surface is clean. Specification: Thermal conductivity: >0.671Wm.k Breaking strength: 1.5MPA Surface vulcanization time: 10Min25degree C Material: Silicone Capacity: 5g Length: 52mm2.05inch Color: As shown Quantity: 1 Pc Package includes: Thermal Silicone Adhesive
ProductSiteLaunchDate : 2021-03-10T09:52:42.066Z
SupplierDeclaredDgHzRegulation : not_applicable