Specification Brand : GZYF BulletPoint : Flux Paste Free Soldering Solder Fit for BGA CSP Ch 10CC 1pcs No-clean Parts 2018 BulletPoint1 : Compatibility Model: The Solder paste is cell phone PCB and SMD like BGA, PGA, etc BulletPoint2 : Premium Quality: The Solder paste is made from premium material, with good heat transfer performance, good lubricity and no flux Reduce BulletPoint3 : Fantastic Function: It is used to repair the circuit boards and protect the electronic components; with high intensity, good immersion and good insulating ability BulletPoint4 : Simple to replace: No need installation, use it directly BulletPoint5 : Parcel List: 1pc Solder Soldering Paste Color : Multicolor Configuration : Refer to description CustomerPackageType : Standard Packaging DesignName : Unisex Edition : Standard Edition ExternallyAssignedProductIdentifier1 : 634345549551 ExternallyAssignedProductIdentifier2 : 0634345549551 FinishType : Refer to description FitType : Standard Flavor : Fig IncludedComponents : Refer to description IncludedComponents1 : flux: 2Bottle/10cc IncludedComponents2 : Desoldering Wick: 10ft 1 volume IncludedComponents3 : IC Pickup Tool: 1 stick ItemDisplayDimensions_Depth : 1.97 inches ItemDisplayDimensions_Diameter : 3.15 inches ItemDisplayDimensions_Height : 1.97 inches ItemDisplayDimensions_Length : 3.15 inches ItemDisplayDimensions_Width : 3.15 inches ItemDisplayWeight : 0.17 pounds ItemForm : Refer to description ItemLengthDescription : Refer to description ItemName : GZYF 10ml RMA223 Soldering Paste No Clean Solder Flux Grease 1pc Cell Phone SMD PCB ItemPackageDimensions_Height : 1 millimeters ItemPackageDimensions_Length : 1 millimeters ItemPackageDimensions_Width : 1 millimeters ItemPackageQuantity : 1 ItemShape : Refer to description ItemTypeKeyword : solder-flux LineWeight : 1 Manufacturer : GZYF Material : refer to description MeasurementSystem : Refer to description MetalType : Refer to description ModelName : Generic-OM75QL5Y3GC64AJCPE0 ModelNumber : OM75QL5Y3GC64AJCPE0 NumberOfBoxes : 1 NumberOfItems : 1 PartNumber : YFUS8DZYJ200_GZ Pattern : Refer to description PowerSourceType : hand_powered ProductDescription : Fitment:
Specification: Condition: Brand New Volume :10ml/10cc Dimension :95X35X23mm
Features: Brand new and high quality High intensity;Good immersion. Good insulating ability. Soldering paste cell phone PCB and SMD like BGA, PGA, etc. Help repair the circuit boards and protect the electronic components. A necessary material repairing the mobile phone motherboard.