Specification Brand : FTVOGUE BulletPoint1 : FOR PACKAGE WORKS: Can be used for rework, BGA, PGA and CSP package pin connections, such as flipping chips to PWB substrates. BulletPoint2 : FOR PACKAGE WORKS: Can be used for rework, BGA, PGA and CSP package pin connections, such as flipping chips to PWB substrates. BulletPoint3 : WIDE APPLICATION: Used for soldering of sensors, wires, connecting tubes, BGA chips, etc., convenient and efficient. BulletPoint4 : PORTABLE DESIGN: With a capacity of 100g/3.5oz, has compact structure, easy to use and carry, and strong practicability. BulletPoint5 : HIGH PERFORMANCE: Environmentally friendly soldering paste, which is easy to tin, no residue, with high insulation resistance. FinishType : Finish IncludedComponents : inc ItemName : FTVOGUE 100g Flux Paste Solder Paste Cream Soldering Product for Electronics Repairing AD‑559, Other Welding Equipment And Accessories ItemPackageDimensions_Height : 7 centimeters ItemPackageDimensions_Length : 20 centimeters ItemPackageDimensions_Width : 15 centimeters ItemPackageQuantity : 1 ItemTypeKeyword : solder-flux Manufacturer : FTVOGUE Material : Material NumberOfItems : 1 PartNumber : FTVOGUEeanprd0yv16524 PowerSourceType : PowerSource ProductDescription : Specification: Item Type: Solder Paste Applications: Universally used in sensors, wires, even tubes, BGA chips, etc. Product Features: Environmental , easy to tin, no residue, high insulation resistance Capacity: Approx. 100g / 3.5oz