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Specification
Brand : FTVOGUE
BulletPoint : Nozzle,M-Series,Flux Cored
BulletPoint1 : MULTIPLE USAGES: Solder paste can be used for maintenance of mobile phones, hard disks, CPUs, ICs, etc., with strong practicability.
BulletPoint2 : NO NEED CLEAN: The high temperature solder paste does not require cleaning flux, easy to operate, with wide range of application.
BulletPoint3 : PASTE COMPOSITION: The composition of the solder paste is Sn96.5, Ag3 and Cu0.5, with 20‑38um (No. 4 powder) particles.
BulletPoint4 : HIGH MELTING POINT: High temperature soldering flux paste has a melting point of 217℃ for more maintenance situations.
BulletPoint5 : HIGH EFFICIENCY: Provides more controlled and accurate welding, increasing efficiency and speeding up the welding process.
ExternallyAssignedProductIdentifier : 4610069449328
ExternallyAssignedProductIdentifier1 : 0380610593780
ExternallyAssignedProductIdentifier2 : 380610593780
FinishType : Finish
IncludedComponents : inc
ItemName : Flux Paste Solder Paste High Temperature Soldering Flux Cream for Electronics Mobile Phone Repairing SFD‑226
ItemPackageDimensions_Height : 2 centimeters
ItemPackageDimensions_Length : 16 centimeters
ItemPackageDimensions_Width : 12 centimeters
ItemPackageQuantity : 1
ItemTypeKeyword : solder-flux
Manufacturer : FTVOGUE
Material : Material
ModelNumber : so801
NumberOfItems : 1
PartNumber : FTVOGUE10mfra6hc76524
PowerSourceType : PowerSource
ProductDescription : Specification:
Item Type: Solder Paste
Model: SFD-226
Composition: Sn96.5, Ag3, Cu0.5
Granules: 20-38um (No. 4 powder)
Applicable: Used to repair mobile phone, hard disk, CPU, IC, etc.
Melting Point: 217℃

Package List:
1 x Solder Paste
ProductSiteLaunchDate : 2024-10-27T00:00:00.000Z
UnitCount : 1
UnspscCode : 23271800