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Specification
Brand : Walfront
BulletPoint1 : -- soldering paste, easy to tin, no residue, with high insulation
BulletPoint2 : PACKAGE REWORK -- used for rework, BGA, PGA and CSP package pin connections, such as flipping chips to substrates
BulletPoint3 : SOLDER ADHESION -- The solder paste has excellent solder adhesion, resistance, and is suitable for multi PCB reflow soldering
BulletPoint4 : 100G/3.5OZ CAPACITY -- With a capacity of 100g/3.5oz, has compact structure, easy to use and carry, and strong practicability
BulletPoint5 : WIDE APPLICATION -- Used for soldering of sensors, wires, connecting tubes, BGA chips, etc., convenient and efficient
Color : Multicolor
ExternallyAssignedProductIdentifier : 6463322891192
IncludedComponents : Carbon Arc Air Gouging Torch
ItemDisplayDimensions_Height : 0.98 inches
ItemDisplayDimensions_Length : 98.43 inches
ItemDisplayDimensions_Width : 4.53 inches
ItemDisplayWeight : 1.32 pounds
ItemName : AD‑559 100g Solder Paste Soldering Flux Paste Soldering Flux Cream for Soldering BGA PGA CSP Connections for Multi PCB Reflow Soldering 100g/3.5oz
ItemPackageDimensions_Height : 7 centimeters
ItemPackageDimensions_Length : 8 centimeters
ItemPackageDimensions_Width : 7 centimeters
ItemPackageQuantity : 1
ItemTypeKeyword : solder-flux
Manufacturer : WALFRONT
Material : copper
ModelName : Walfront6qzstoym58
ModelNumber : WALFRONT6qzstoym58
NumberOfItems : 1
NumberOfLithiumMetalCells : 1
PartNumber : WALFRONT6qzstoym58
Pattern : Solid
PowerSourceType : ac
ProductDescription : Spec:
Item Type: Solder Paste
Applications: Universally used in sensors, wires, even tubes, BGA chips, etc.
Product Features: Environmental , easy to tin, no residue, high insulation resistance
Capacity: Approx. 100g / 3.5oz

Package List:
1 x Solder Paste

1. : soldering paste, easy to tin, no residue, with high insulation resistance.
2. FOR PACKAGE WORKS: used for rework, BGA, PGA and CSP package pin connections, such as flipping chips to substrates.
3. GOOD ADHESION: The solder paste has excellent solder adhesion, resistance, and is suitable for multi PCB reflow soldering.
4. PORTABLE DESIGN: With a capacity of 100g/3.5oz, has compact structure, easy to use and carry, and strong practicability.
5. WIDE APPLICATION: Used for soldering of sensors, wires, connecting tubes, BGA chips, etc., convenient and efficient.
ProductSiteLaunchDate : 2023-12-23T00:00:00.000Z
Size : 405B
SupplierDeclaredDgHzRegulation : not_applicable
SupplierDeclaredHasProductIdentifierExemption : 1
UnitCount : 1
UnspscCode : 23271800