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Specification
Brand : Walfront
BulletPoint1 : HIGH PERFORMANCE -- Environmentally friendly soldering paste, which is easy to tin, no residue, with high insulation resistance
BulletPoint2 : PACKAGE REWORK -- Can be used for rework, BGA, PGA and CSP package pin connections, such as flipping chips to PWB substrates
BulletPoint3 : SOLDER ADHESION -- The solder paste has excellent solder adhesion, resistance, and is suitable for multi PCB reflow soldering
BulletPoint4 : 100G/3.5OZ CAPACITY -- With a capacity of 100g/3.5oz, has compact structure, easy to use and carry, and strong practicability
BulletPoint5 : WIDE APPLICATION -- Used for soldering of sensors, wires, connecting tubes, BGA chips, etc., convenient and efficient
FinishType : Finish
IncludedComponents : inc
ItemName : AD‑559 100g Solder Paste Soldering Flux Cream for Soldering BGA PGA CSP Connections for Multi PCB Reflow Soldering (100g / 3.5oz in a Jar)
ItemPackageDimensions_Height : 7 centimeters
ItemPackageDimensions_Length : 8 centimeters
ItemPackageDimensions_Width : 7 centimeters
ItemPackageQuantity : 1
ItemTypeKeyword : solder-flux
Manufacturer : Walfront
Material : Material
NumberOfItems : 1
PartNumber : Walfront1w78s53gnq6022
PowerSourceType : PowerSource
ProductDescription : Specification:
Item Type: Solder Paste
Applications: Universally used in sensors, wires, even tubes, BGA chips, etc.
Product Features: Environmental , easy to tin, no residue, high insulation resistance
Capacity: Approx. 100g / 3.5oz

Package List:
1 x Solder Paste

How to Use:
Can be used directly.

Feature:
1. HIGH PERFORMANCE: Environmentally friendly soldering paste, which is easy to tin, no residue, with high insulation resistance.
2. FOR PACKAGE WORKS: Can be used for rework, BGA, PGA and CSP package pin connections, such as flipping chips to PWB substrates.
3. GOOD ADHESION: The solder paste has excellent solder adhesion, resistance, and is suitable for multi PCB reflow soldering.
4. PORTABLE DESIGN: With a capacity of 100g/3.5oz, has compact structure, easy to use and carry, and strong practicability.
5. WIDE APPLICATION: Used for soldering of sensors, wires, connecting tubes, BGA chips, etc., convenient and efficient.

ProductSiteLaunchDate : 2022-03-16T00:00:00.000Z
SupplierDeclaredDgHzRegulation : not_applicable