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Specification
Brand : Chip Quik
BulletPoint : Solder Wire
BulletPoint1 : ¡¾Features¡¿Environmentally friendly ?, refined materials, strengthened solder ball soldering capabilities.
BulletPoint2 : ¡¾Performance¡¿Ultra?small ball?shaped tin electronic parts, which can transmit electronic .
BulletPoint3 : ¡¾Description¡¿The diameter of the solder ball with IC packaging is approx. 0.2?0.76mm/0.008?0.03in.
BulletPoint4 : ¡¾Professional design¡¿Trace elements added to the solder balls to improve the oxidation ability and reliability of the solder balls.
BulletPoint5 : ¡¾Widely Used¡¿ Widely used in connecting semiconductor chips, circuit templates, PCB boards, and transmit electronic .
ExternallyAssignedProductIdentifier1 : 0708210652117
ExternallyAssignedProductIdentifier2 : 708210652117
FinishType : Finish
Hazmat : auto-grounding
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ItemName : (QTY 2) Chip Quik NC3SW.031 0.5OZ Solder Wire Mini Pocket Pack 62/36/2 Tin/Lead/Silver No-Clean .031 .5oz
ItemPackageDimensions_Height : 0.5 inches
ItemPackageDimensions_Length : 5 inches
ItemPackageDimensions_Width : 2 inches
ItemPackageQuantity : 1
ItemTypeKeyword : solder
Manufacturer : Chip Quik®
Material : copper
Material1 : Material
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Material5 : Material
ModelNumber : NC3SW.031 0.5OZ-2X
PartNumber : NC3SW.031 0.5OZ-2X
PowerSourceType : PowerSource
ProductDescription : Lead-Free / RoHS 3 Compliant / REACH Compliant Description Smooth FlowTM Technology Developed with a lower density flux vehicle for better shear spread and improved flow during heating Halogen Free (EN14582 test method) Specifications Alloy: Sn42/Bi57/Ag1 Flux Type: Synthetic No-Clean Flux Classification: ROL0 Metal Content: 85.75% metal by weight. Particle Size: T5 (15-25 microns) Melting Point: 137C (279F) Size: 10cc/35g syringe Shelf Life Refrigerated >12 months, unrefrigerated >6 months Stencil Life >8 hours @ 20-50% RH 22-28C (72-82F) >4 hours @ 50-70% RH 22-28C (72-82F) Stencil Cleaning Automated stencil cleaning systems for both stencil and misprinted boards. Manual cleaning using isopropyl alcohol (IPA). Storage and Handling Refrigerate at 3-8C (37-46F). Do not freeze. Allow 4 hours for solder paste to reach an operating temperature of 20-25C (68-77F) before use. Transportation This product has no shipping restrictions. Shipping below 0C (32F) or above 25C (77F) for normal transit times by ground or air will not impact this product's stated shelf life.
ProductSiteLaunchDate : 2021-06-29T13:50:23.819Z
SafetyDataSheetUrl : http://www.chipquik.com/msds/NC3SW.031 0.5OZ.pdf
SupplierDeclaredDgHzRegulation : not_applicable
UnitCount : 1