Lead-Free Solder Paste, No-Clean High Thermal Conductivity And Conductivity Tin Paste For Cell Phone PCB/IC/BGA/SMD CPU Repairing(SAC305,30G)

Customer rating 4.1 stars

Imported from USA | Ships in 10 working days

5% additional discount on UPI | Cash On Delivery available

1

₹7100 -38% ₹4400/-

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Product Information


Specification
Brand : Essmetuin
BulletPoint1 : Essmetuin SAC305 Solder Paste Content: Alloy Tin 96.5%Ag3%Cu0.5%, Solder Flux Content: 10.8%
BulletPoint2 : Lead-Free Solder Paste -High-Temperature Solder Paste With Flux, Melting Point: 217 ℃ (422.6.4F)
BulletPoint3 : Product Advantages: Pushing-Type Design Smoother Flowing No Wasting During Welding
BulletPoint4 : Widely Used In BGA /SMD Circuit Board,Motors, Lighting, IC, TV and Other Household Appliances And Industrial Equipment, Sensors, Wires, Fuses, Phone, Metal Shells, Motors, Lighting, Connectors, SMT Maintenance
BulletPoint5 : High thermal conductivity and conductivity.The Post Soldering Transparent Residues Are Non-Conductive, Non-Corrosive And Highly Insulated
Color : Grey
CustomerPackageType : Standard Packaging
ExternallyAssignedProductIdentifier1 : 779008489529
ExternallyAssignedProductIdentifier2 : 0779008489529
ExternallyAssignedProductIdentifier3 : 00779008489529
GpsrSafetyAttestation : 1
IncludedComponents : SAC305 Solder Paste
ItemDisplayWeight : 30 grams
ItemName : Lead-Free Solder Paste, No-Clean High Thermal Conductivity And Conductivity Tin Paste For Cell Phone PCB/IC/BGA/SMD CPU Repairing(SAC305,30G)
ItemPackageDimensions_Height : 17.0942 centimeters
ItemPackageDimensions_Length : 1.905 centimeters
ItemPackageDimensions_Width : 9.398 centimeters
ItemPackageQuantity : 1
ItemTypeKeyword : solder
Manufacturer : ZHUOBAO
Material : lead
ModelName : Essmetuin Solder Paste
ModelNumber : SAC305
NumberOfBoxes : 1
NumberOfItems : 1
PackageLevel : unit
PartNumber : 4895-227G
PowerSourceType : fuel_powered
ProductDescription : Essmetuin SAC305 Sn96.5Ag3.0Cu0.5 Melting Point 217℃ Tin Lead-Free Solder Paste, No-Clean High Thermal Conductivity And Conductivity Tin Paste For Cell Phone PCB/IC/BGA /SMD CPU Repairing(30G )
ProductSiteLaunchDate : 2023-02-19T15:49:55.826Z
SafetyDataSheetUrl : https://www.mgchemicals.com/downloads/msds/01%20English%20Can-USA%20SDS/sds-4890-4898.pdf
Size : Sn96.5Ag3.0Cu0.5
SkipOffer : 1
SupplierDeclaredDgHzRegulation : not_applicable
SupplierDeclaredHasProductIdentifierExemption : 1
TargetAudienceKeyword1 : jewelry makers
TargetAudienceKeyword2 : jewelry repair
TargetAudienceKeyword3 : jewelry silver soldering
UnitCount : 1
UnspscCode : 23271800

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Read all 14 customer reviews

A mixed experience overall.

Best product IÕve bought recently.

A smart purchase for the price.

Worth the price, satisfied.

A smart purchase for the price.

Will be purchasing again soon.

Performs well under regular usage.

Quality is fine, but packaging was average.

Expected a bit more for the price.

Well priced and good quality.

Top-notch quality, canÕt complain.

This is a game changer!

Happy with the quality and performance.

Five stars all the way.

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