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Specification
Brand : EVTSCAN
BulletPoint1 : widely used in ultra‑small spherical tin electronic parts that connect semiconductor chips, circuit templates and PCB boards, and transmit electronic signals.
BulletPoint2 : The diameter of the solder ball for IC packaging is approx. 0.2 ~ 0.76mm / 0.01 ~ 0.03in.
BulletPoint3 : Trace elements are added to the solder balls to improve the oxidation ability and reliability of the solder balls
BulletPoint4 : Refined materials are environmentally friendly and lead‑free, and strengthen the solder ball soldering ability
BulletPoint5 : With a large number, can meet your use and replacement needs, very practically
Capacity : 20 grams
ItemName : Lead-Free Solder Balls,BGA Lead‑Free Solder Ball Tin Balls 25W for PCB Board Rework Reballing Accessories 0.55MM
ItemPackageDimensions_Height : 7 centimeters
ItemPackageDimensions_Length : 8 centimeters
ItemPackageDimensions_Width : 7 centimeters
ItemPackageQuantity : 1
ItemTypeKeyword : solder
Manufacturer : EVTSCAN
Material : lead
ModelNumber : ‎AEC-SFP-217℃
NumberOfItems : 1
PartNumber : EVTSCANmy52cfp0bs
ProductDescription :

Specification:

Item Type: BGA Lead‑Free Solder Ball

Product Composition: Sn96.5%/Ag3%/Cu0.5%
Specification: Approx. 0.55mm / 0.02in 250,000 grains
Purpose: Chip planting beads and ball planting
Scope of Application: BGA package soldering, filling, maintenance, ball planting

Package List:

1 Bottle of Tin Balls
ProductSiteLaunchDate : 2021-09-06T03:37:22.541Z
Style : 217°C-20G-1Pcs
SupplierDeclaredDgHzRegulation : not_applicable
UnspscCode : 23271800