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Specification
Brand : Chip Quik
ExternallyAssignedProductIdentifier : 7104632363823
ExternallyAssignedProductIdentifier1 : 0708210652575
ExternallyAssignedProductIdentifier2 : 708210652575
ItemName : Chip Quik WS991LT500T4 Thermally Stable Solder Paste WS (Water-Soluble) Sn42/Bi57.6/Ag0.4 T4 (500g jar)
ItemPackageDimensions_Height : 3 inches
ItemPackageDimensions_Length : 3 inches
ItemPackageDimensions_Width : 3 inches
ItemTypeKeyword : solder
Manufacturer : Chip Quik
Material : Solder Paste
ModelNumber : WS991LT500T4
PartNumber : WS991LT500T4
ProductDescription : Lead-Free / RoHS 3 Compliant / REACH Compliant Description Solder Paste in jar 500g (T4) Sn42/Bi57.6/Ag0.4 Low Temperature 90% metal melts @ 138C, 281F Water-Soluble. Alloy: Sn42/Bi57.6/Ag0.4 Flux Type: Synthetic Water-Soluble Flux Classification: REL0 Metal Content: 90% metal by weight. Particle Size: T4 (20-38 microns) Melting Point: 138C (281F) Size: 500g jar Shelf Life Refrigerated >6 months, unrefrigerated >6 months Stencil Life >8 hours @ 20-50% RH 22-28C (72-82F) >4 hours @ 50-70% RH 22-28C (72-82F) Stencil Cleaning Automated stencil cleaning systems for both stencil and misprinted boards. Manual cleaning using isopropyl alcohol (IPA). Storage and Handling Store at 3-25C (37-77F). Do not freeze. Refrigeration is not required, but will extend shelf life. Allow 4 hours for solder paste to reach an operating temperature of 20-25C (68-77F) before use. Transportation This product has no shipping restrictions. Shipping below 0C (32F) or above 25C (77F) for normal transit times by ground or air will not impact this product's stated shelf life.
ProductSiteLaunchDate : 2021-02-04T21:03:58.918Z
SafetyDataSheetUrl : http://www.chipquik.com/msds/WS991LT500T4.pdf
SupplierDeclaredDgHzRegulation : not_applicable