Chip Quik TS991SNL500T3 Thermally Stable Solder Paste NC (No-Clean) Sn96.5/Ag3.0/Cu0.5 T3 (500g jar)

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Product Information


Specification
Brand : Chip Quik
BulletPoint : Solder Wire
BulletPoint1 : Sale Unit: POUND
BulletPoint2 : Brand: Kester
BulletPoint3 : Core Type: Acid Flux Core
BulletPoint4 : Wire Diameter: 0.125 in
BulletPoint5 : Lead Content: 60 %
BulletPoint6 : 1 Pound Spool
Color : Kester "Green/Tan" Label
ExternallyAssignedProductIdentifier1 : 0708210652544
ExternallyAssignedProductIdentifier2 : 708210652544
Hazmat : auto-grounding
IncludedComponents : (1) AIM 15671 Wire Solder Spool. 1 Pound per Spool
ItemDisplayDimensions_Height : 0.75 inches
ItemDisplayDimensions_Length : 3 inches
ItemDisplayDimensions_Width : 3 inches
ItemName : Chip Quik TS991SNL500T3 Thermally Stable Solder Paste NC (No-Clean) Sn96.5/Ag3.0/Cu0.5 T3 (500g jar)
ItemPackageDimensions_Height : 3 inches
ItemPackageDimensions_Length : 3 inches
ItemPackageDimensions_Width : 3 inches
ItemPackageQuantity : 1
ItemTypeKeyword : solder
Manufacturer : Chip Quik
Material : Solder Paste
ModelName : AIM No-Clean SAC305 Wire Solder w/ CX18 Flux
ModelNumber : TS991SNL500T3
NumberOfBoxes : 1
PartNumber : TS991SNL500T3
PowerSourceType : hand_powered
ProductDescription : Lead-Free / RoHS 3 Compliant / REACH Compliant Description Chip Quik 991 Series Thermally Stable Solder Paste No-Clean Lead-Free SAC305 in 500g jar. Revolutionary Formula: No Refrigeration Required! Alloy: Sn96.5/Ag3.0/Cu0.5 Flux Type: Synthetic No-Clean Flux Classification: REL0 Metal Content: 88.5% metal by weight. Particle Size: T3 (25-45 microns) Melting Point: 217C (423F) Size: 500g jar Shelf Life Refrigerated >12 months, unrefrigerated >12 months Stencil Life >8 hours @ 20-50% RH 22-28C (72-82F) >4 hours @ 50-70% RH 22-28C (72-82F) Stencil Cleaning Automated stencil cleaning systems for both stencil and misprinted boards. Manual cleaning using isopropyl alcohol (IPA). Storage and Handling Store at 3-25C (37-77F). Do not freeze. Refrigeration is not required, but will extend shelf life. Allow 4 hours for solder paste to reach an operating temperature of 20-25C (68-77F) before use. Transportation This product has no shipping restrictions. Shipping below 0C (32F) or above 25C (77F) for normal transit times by ground or air will not impact this product's stated shelf life.
ProductSiteLaunchDate : 2021-02-04T19:28:28.400Z
SafetyDataSheetUrl : http://www.chipquik.com/msds/TS991SNL500T3.pdf
Size : 5g
Style : 0.006" Diameter
SupplierDeclaredDgHzRegulation : not_applicable
UnitCount : 1
UnspscCode : 23271800

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