Chip Quik TS391SNL250 Thermally Stable Solder Paste No-Clean Sn96.5/Ag3.0/Cu0.5 T4 (250g jar)

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Product Information


Specification
Brand : Chip Quik
BulletPoint : Solder Paste
BulletPoint1 : Made of high quality aluminum alloy,not rust,stronger than the base metal - up to 45,900 psi.
BulletPoint2 : Low temperature,melting point between 647-658°C.
BulletPoint3 : Can use to any heat source, such as propane, butane, mapp, or an oxy-acetylene torch.
BulletPoint4 : Ideal for repairs and maintenance.
BulletPoint5 : The materials have been strictly screened and the quality is higher than that of products of the same level.
Color : Er5356
ExternallyAssignedProductIdentifier : 7612792088062
ExternallyAssignedProductIdentifier1 : 0700254126692
ExternallyAssignedProductIdentifier2 : 700254126692
ExternallyAssignedProductIdentifier3 : 00037103325747
IncludedComponents : Weller Wep 70 Barrel Spare Part
ItemName : Chip Quik TS391SNL250 Thermally Stable Solder Paste No-Clean Sn96.5/Ag3.0/Cu0.5 T4 (250g jar)
ItemPackageDimensions_Height : 2.5 inches
ItemPackageDimensions_Length : 2 inches
ItemPackageDimensions_Width : 2.5 inches
ItemPackageQuantity : 1
ItemTypeKeyword : solder
Manufacturer : Chip Quik®
Material : lead
ModelName : Weller Wep 70 Barrel Spare Part
ModelNumber : SMD3SWLT.047 4OZ
NumberOfBoxes : 1
NumberOfItems : 1
NumberOfPieces : 1
PartNumber : TS391SNL250
ProductDescription : Lead-Free / RoHS 3 Compliant / REACH Compliant Description Chip Quik TS [Thermally Stable] Solder Paste No-Clean Lead-Free SAC305 in 250g jar. Revolutionary Formula: No Refrigeration Required! Alloy: Sn96.5/Ag3.0/Cu0.5 Flux Type: Synthetic No-Clean Flux Classification: ROL0 Metal Content: 88.5% metal by weight. Particle Size: T4 (20-38 microns) Melting Point: 217-220C (423-428F) Size: 250g jar Shelf Life Refrigerated >12 months, unrefrigerated >12 months Stencil Life >12 hours @ 20-50% RH 22-28C (72-82F) >4 hours @ 50-70% RH 22-28C (72-82F) Stencil Cleaning Automated stencil cleaning systems for both stencil and misprinted boards. Manual cleaning using isopropyl alcohol (IPA). Storage and Handling Store at room temperature 20-25C (68-77F). Do not freeze. Chip Quik Thermally Stable solder paste should be stored at its operating temperature (room temperature) of 20-25C (68-77F), therefore no warming time is required before use. Transportation This product has no shipping restrictions. Shipping below 0C (32F) or above 25C (77F) for normal transit times by ground or air will not impact this product's stated shelf life.
ProductSiteLaunchDate : 2017-12-07T21:06:31.888Z
SafetyDataSheetUrl : http://www.chipquik.com/msds/TS391SNL250.pdf
Size : 2.4mm
SupplierDeclaredDgHzRegulation : not_applicable
UnitCount : 1

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