Chip Quik TS391SNL10 Thermally Stable Solder Paste No-Clean Sn96.5/Ag3.0/Cu0.5 T4 (35g syringe)

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₹ 6800/-

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Product Information


Specification
Brand : Chip Quik
BulletPoint : Hillsdale Terminal
BulletPoint1 : Thermally Stable
BulletPoint2 : SAC305
BulletPoint3 : RoHS
BulletPoint4 : Lead-Free
Color : Green (Lead-free)
ExternallyAssignedProductIdentifier : 5053485716060
ExternallyAssignedProductIdentifier1 : 700254126685
ExternallyAssignedProductIdentifier2 : 0700254126685
FinishType : Finish
IncludedComponents1 : inc
IncludedComponents2 : inc
IncludedComponents3 : inc
IncludedComponents4 : inc
IncludedComponents5 : inc
IncludedComponents6 : inc
IncludedComponents7 : inc
IncludedComponents8 : inc
IncludedComponents9 : inc
ItemDisplayDimensions_Height : 1 inches
ItemDisplayDimensions_Length : 5 inches
ItemDisplayDimensions_Width : 3 inches
ItemName : Chip Quik TS391SNL10 Thermally Stable Solder Paste No-Clean Sn96.5/Ag3.0/Cu0.5 T4 (35g syringe)
ItemPackageDimensions_Height : 1 inches
ItemPackageDimensions_Length : 6 inches
ItemPackageDimensions_Width : 3 inches
ItemPackageQuantity : 1
ItemTypeKeyword : solder
Manufacturer : Chip Quik®
Material : metal
ModelNumber : TS391SNL10
NumberOfBoxes : 1
NumberOfItems : 1
PartNumber : TS391SNL10
PowerSourceType : PowerSource
ProductDescription : Chip Quik TS [Thermally Stable] Solder Paste No-Clean Lead-Free SAC305 in 10cc syringe 35g w/plunger & tip. Revolutionary Formula: No Refrigeration Required! Alloy: Sn96.5/Ag3.0/Cu0.5 Flux Type: Synthetic No-Clean Flux Classification: ROL0 Metal Content: 87% metal by weight. Particle Size: T4 (20-38 microns) Melting Point: 217-220C (423-428F) Size: 10cc/35g syringe Shelf Life Refrigerated >12 months, unrefrigerated >12 months Stencil Life >12 hours @ 20-50% RH 22-28C (72-82F) >4 hours @ 50-70% RH 22-28C (72-82F) Stencil Cleaning Automated stencil cleaning systems for both stencil and misprinted boards. Manual cleaning using isopropyl alcohol (IPA). Storage and Handling Store at room temperature 20-25C (68-77F). Do not freeze. Chip Quik Thermally Stable solder paste should be stored at its operating temperature (room temperature) of 20-25C (68-77F), therefore no warming time is required before use. Transportation This product has no shipping restrictions. Shipping below 0C (32F) or above 25C (77F) for normal transit times by ground or air will not impact this product's stated shelf life.
ProductSiteLaunchDate : 2017-12-07T21:06:31.528Z
SafetyDataSheetUrl : https://www.chipquik.com/msds/TS391SNL10.pdf
Size : Thrее Расk
StreetDate : 2018-07-05T00:00:01Z
SupplierDeclaredDgHzRegulation : not_applicable
UnitCount : 1

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