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Specification
Brand : Chip Quik
BulletPoint : Solder Paste
BulletPoint1 : Alloy: Eutectic Tin/CopperCore Size: 66
BulletPoint2 : Diameter: 0.020"Flux %: 66/3.3
BulletPoint3 : Flux Type: Activated RosinLead-Free: Yes
BulletPoint4 : Melting Point: 441¡ãF
BulletPoint5 : Pot Solder Capacity: 500g Slot Diameter: 50mm Power: 160W
Color : No Color
ExternallyAssignedProductIdentifier1 : 0700254126760
ExternallyAssignedProductIdentifier2 : 700254126760
ExternallyAssignedProductIdentifier3 : 00038753530154
FinishType : Resin
Hazmat1 : ENVIRONMENTALLY HAZARDOUS SUBSTANCE, SOLID, N.O.S., 40/60 Acid Core Wire Solder - Carded
Hazmat10 : CN_Unregulated
Hazmat11 : DE_Unregulated
Hazmat12 : EG_Unregulated
Hazmat13 : ES_Unregulated
Hazmat14 : FR_Unregulated
Hazmat15 : GB_Unregulated
Hazmat16 : IN_Unregulated
Hazmat17 : IT_Unregulated
Hazmat18 : JP_Unregulated
Hazmat19 : MX_Unregulated
Hazmat2 : UN3077
Hazmat20 : NL_Unregulated
Hazmat21 : PL_Unregulated
Hazmat22 : SA_Unregulated
Hazmat23 : SE_Unregulated
Hazmat24 : SG_Unregulated
Hazmat25 : TR_Unregulated
Hazmat26 : US_Unregulated
Hazmat27 : ZA_Unregulated
Hazmat3 : III
Hazmat4 : 9
Hazmat5 : AE_Unregulated
Hazmat6 : AU_Unregulated
Hazmat7 : BE_Unregulated
Hazmat8 : BR_Unregulated
Hazmat9 : CA_Unregulated
HeatingElementType : Ceramic
IncludedComponents : Electrical & Heating;Electrical Replacement Parts;room-air-conditioner-replacement-parts
ItemDisplayWeight : 0.3 pounds
ItemForm : Coil
ItemName : Chip Quik TS391LT50 Thermally Stable Solder Paste No-Clean Sn42/Bi57.6/Ag0.4 T4 (50g jar)
ItemPackageDimensions_Height : 5.1054 centimeters
ItemPackageDimensions_Length : 3.302 centimeters
ItemPackageDimensions_Width : 5.0038 centimeters
ItemPackageQuantity : 1
ItemShape : Round Rod
ItemTypeKeyword : solder
Manufacturer : Chip Quik®
Material : lead
ModelName : 53015
ModelNumber : TS391LT50
NumberOfBoxes : 1
NumberOfItems : 1
PackageLevel : unit
PartNumber : TS391LT50
PowerSourceType : Corded Electric
ProductDescription : Lead-Free / RoHS 3 Compliant / REACH Compliant Description Chip Quik TS [Thermally Stable] Solder Paste No-Clean Lead-Free Sn/Bi/Ag in 50g jar. Revolutionary Formula: No Refrigeration Required! Alloy: Sn42/Bi57.6/Ag0.4 Flux Type: Synthetic No-Clean Flux Classification: ROL0 Metal Content: 90% metal by weight. Particle Size: T4 (20-38 microns) Melting Point: 138C (281F) Size: 50g jar Shelf Life Refrigerated >12 months, unrefrigerated >12 months Stencil Life >12 hours @ 20-50% RH 22-28C (72-82F) >4 hours @ 50-70% RH 22-28C (72-82F) Stencil Cleaning Automated stencil cleaning systems for both stencil and misprinted boards. Manual cleaning using isopropyl alcohol (IPA). Storage and Handling Store at room temperature 20-25C (68-77F). Do not freeze. Chip Quik Thermally Stable solder paste should be stored at its operating temperature (room temperature) of 20-25C (68-77F), therefore no warming time is required before use. Transportation This product has no shipping restrictions. Shipping below 0C (32F) or above 25C (77F) for normal transit times by ground or air will not impact this product's stated shelf life.
ProductExpirationType : Shelf Life
ProductSiteLaunchDate : 2017-12-07T21:06:35.413Z
RecommendedUsesForProduct : electronics assembly, soldering plated through holes, surface mount technology (SMT) applications
SafetyDataSheetUrl : http://www.chipquik.com/msds/TS391LT50.pdf
Size : 50mm 500g 160w
Style : Pencil
SupplierDeclaredDgHzRegulation : not_applicable
UnitCount : 1