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Specification
Brand : Chip Quik
BulletPoint : Solder Paste
BulletPoint1 : The product is 8OZ.062Bulk Elec Solder
BulletPoint2 : Easy to use
BulletPoint3 : The product is manufactured in China
BulletPoint4 : Melting Point: 441¡ãF
BulletPoint5 : “Instant-action” wetting behavior
Color : Green (Lead-free)
ExternallyAssignedProductIdentifier1 : 0700254126746
ExternallyAssignedProductIdentifier2 : 700254126746
ExternallyAssignedProductIdentifier3 : 00031427216040
GpsrSafetyAttestation : 1
IncludedComponents : Solder Wire Spool/Tube
IncludedComponents1 : Soldering/Heat Guns
IncludedComponents2 : Solder
ItemDisplayDimensions_Height : 0.75 inches
ItemDisplayDimensions_Length : 3 inches
ItemDisplayDimensions_Width : 3 inches
ItemName : Chip Quik TS391LT250 Thermally Stable Solder Paste No-Clean Sn42/Bi57.6/Ag0.4 T4 (250g jar)
ItemPackageDimensions_Height : 2.5 inches
ItemPackageDimensions_Length : 2 inches
ItemPackageDimensions_Width : 2.5 inches
ItemPackageQuantity : 1
ItemTypeKeyword : solder
Manufacturer : Chip Quik®
Material : lead
MeasurementSystem : Metric
ModelName : Chip Quik SMDSWLF Lead-Free Solder Wire SAC305 No-Clean Water-Washable
ModelNumber : AM21604
NumberOfBoxes : 1
NumberOfItems : 1
PackageLevel : unit
PartNumber : TS391LT250
Pattern : Rosin
PowerSourceType : Crank
ProductDescription : Lead-Free / RoHS 3 Compliant / REACH Compliant Description Chip Quik TS [Thermally Stable] Solder Paste No-Clean Lead-Free Sn/Bi/Ag in 250g jar. Revolutionary Formula: No Refrigeration Required! Alloy: Sn42/Bi57.6/Ag0.4 Flux Type: Synthetic No-Clean Flux Classification: ROL0 Metal Content: 90% metal by weight. Particle Size: T4 (20-38 microns) Melting Point: 138C (281F) Size: 250g jar Shelf Life Refrigerated >12 months, unrefrigerated >12 months Stencil Life >12 hours @ 20-50% RH 22-28C (72-82F) >4 hours @ 50-70% RH 22-28C (72-82F) Stencil Cleaning Automated stencil cleaning systems for both stencil and misprinted boards. Manual cleaning using isopropyl alcohol (IPA). Storage and Handling Store at room temperature 20-25C (68-77F). Do not freeze. Chip Quik Thermally Stable solder paste should be stored at its operating temperature (room temperature) of 20-25C (68-77F), therefore no warming time is required before use. Transportation This product has no shipping restrictions. Shipping below 0C (32F) or above 25C (77F) for normal transit times by ground or air will not impact this product's stated shelf life.
ProductSiteLaunchDate : 2017-12-07T21:06:34.690Z
SafetyDataSheetUrl : http://www.chipquik.com/msds/TS391LT250.pdf
Size : 2g
SpecificUsesForProduct : Electronic manufacturing and repair
Style : 0.006" Diameter
SupplierDeclaredDgHzRegulation : not_applicable
SupplierDeclaredDgHzRegulation1 : storage
SupplierDeclaredDgHzRegulation2 : storage
SupplierDeclaredDgHzRegulation3 : storage
SupplierDeclaredDgHzRegulation4 : storage
SupplierDeclaredDgHzRegulation5 : storage
TargetAudienceKeyword1 : SILVER SOLDER
TargetAudienceKeyword2 : HANDY FLUX
UnitCount : 1
UnspscCode : 23271800