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Specification
Brand : Chip Quik
BulletPoint : Solder Wire
BulletPoint1 : Alloy: eutectic tin/copper core size: 66
BulletPoint2 : Diameter: 0.031 inch
BulletPoint3 : Flux type: no-clean lead-free: yes
BulletPoint4 : Melting Point: 441¡ãF
BulletPoint5 : “Instant-action” wetting behavior
Color : Green (Lead-free)
ExternallyAssignedProductIdentifier1 : 708210654067
ExternallyAssignedProductIdentifier2 : 0708210654067
GpsrSafetyAttestation : 1
IncludedComponents : Solder Wire Spool/Tube
ItemDisplayDimensions_Height : 0.75 inches
ItemDisplayDimensions_Length : 3 inches
ItemDisplayDimensions_Width : 3 inches
ItemName : Chip Quik SMDSWLF Lead-Free Solder Wire SAC 305 Sn96.5/Ag3.0/Cu0.5 (0.006" Diameter, Solder Wire on Spool, 2g)
ItemPackageDimensions_Height : 1 inches
ItemPackageDimensions_Length : 3 inches
ItemPackageDimensions_Width : 5 inches
ItemPackageQuantity : 1
ItemTypeKeyword : solder
Manufacturer : Chip Quik
Material : Solder Wire on Spool
ModelName : Chip Quik SMDSWLF Lead-Free Solder Wire SAC305 No-Clean Water-Washable
ModelNumber : SMDSWLF.006 2g
NumberOfBoxes : 1
NumberOfItems : 1
PackageLevel : unit
PartNumber : SMDSWLF.006 2g
Pattern : Rosin
PowerSourceType : Crank
ProductDescription : PRODUCT HIGHLIGHTS: - No-Clean Water-Washable Synthetic Flux Core. - The clear, non-corrosive, non-conductive residue is meant to be left on the board. Residues that do remain are water soluble if you want to remove them. Clean with hot water at 60C (140F) minimum. - Halogen content: None. - RoHS 3 and REACH Compliant. Specifications: Alloy: Sn96.5/Ag3.0/Cu0.5. Melting Point: 217-220C (423-428F). Synthetic Rosin Flux Core.
ProductSiteLaunchDate : 2022-02-02T17:08:20.002Z
SafetyDataSheetUrl : http://www.chipquik.com/msds/TC3-10G.pdf
Size : 2g
SpecificUsesForProduct : Electronic manufacturing and repair
Style : 0.006" Diameter
SupplierDeclaredDgHzRegulation : not_applicable
TargetAudienceKeyword1 : SILVER SOLDER
TargetAudienceKeyword2 : HANDY FLUX
UnitCount : 1
UnspscCode : 23271800