Chip Quik SMDLTLFP10 Solder Paste no clean Sn42/Bi57.6/Ag0.4 Low Temp 138C in 10cc syringe 35g (T3)

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Product Information


Specification
Brand : Chip Quik
BulletPoint : Lead-Free / RoHS Compliant
BulletPoint1 : 2 in 1 Solder Wire, Included thin Solder 0.3mm/0.01inch and 1.0mm/0.04inch, for most electronic soldering
BulletPoint2 : Lead-Free Solder Wire, ideal no lead solder for engineer to soldering the electronics for DIY or repair
BulletPoint3 : Alloy Solder wire Sn99 Ag0.3 Cu0.7, the silver with great electricity conductivity, good for audio video products
BulletPoint4 : Both solder with rosin flux core, easy for soldering, no need clean, good soldering stability and solder joint
BulletPoint5 : Flow well solder, melting temperature at 419 Deg.F ( 217 Deg.C), work with all soldering station iron
Color : silver
ExternallyAssignedProductIdentifier : 3341854182359
ExternallyAssignedProductIdentifier1 : 700254126616
ExternallyAssignedProductIdentifier2 : 0700254126616
FinishType : Polished
IncludedComponents : Unlead Solder Wire 0.01 and 0.02, 50g each spool
ItemDisplayWeight : 1.5 ounces
ItemForm : Coil
ItemName : Chip Quik SMDLTLFP10 Solder Paste no clean Sn42/Bi57.6/Ag0.4 Low Temp 138C in 10cc syringe 35g (T3)
ItemPackageDimensions_Height : 11.2 centimeters
ItemPackageDimensions_Length : 3.5 centimeters
ItemPackageDimensions_Width : 6.8 centimeters
ItemPackageQuantity : 1
ItemShape : Round Rod
ItemTypeKeyword : solder
Manufacturer : Chip Quik®
Material : Metal
ModelName : Electronic Solder
ModelNumber : SMDLTLFP10
NumberOfBoxes : 1
NumberOfItems : 1
PartNumber : SMDLTLFP10
PowerSourceType : dc
ProductDescription : Description Solder Paste Lead-Free Sn42/Bi57.6/Ag0.4 Low Temperature T3 mesh 10cc Syringe. Alloy: Sn42/Bi57.6/Ag0.4 Flux Type: Synthetic No-Clean Flux Classification: REL0 Metal Content: 87% metal by weight. Particle Size: T3 (25-45 microns) Melting Point: 138C (281F) Size: 10cc/35g syringe Shelf Life Refrigerated >6 months, unrefrigerated >2 months Stencil Life >8 hours @ 20-50% RH 22-28C (72-82F) >4 hours @ 50-70% RH 22-28C (72-82F) Stencil Cleaning Automated stencil cleaning systems for both stencil and misprinted boards. Manual cleaning using isopropyl alcohol (IPA). Storage and Handling Refrigerate at 3-8C (37-46F). Do not freeze. Allow 4 hours for solder paste to reach an operating temperature of 20-25C (68-77F) before use. Transportation This product has no shipping restrictions. Shipping below 0C (32F) or above 25C (77F) for normal transit times by ground or air will not impact this product's stated shelf life.
ProductSiteLaunchDate : 2017-12-07T21:06:28.177Z
SafetyDataSheetUrl : http://www.chipquik.com/msds/smdltlfp10.pdf
Size : 8 Feet
SpecificUsesForProduct : Electronics Soldering
Style : Hard
SupplierDeclaredDgHzRegulation : not_applicable
SupplierDeclaredHasProductIdentifierExemption : 1
UnitCount : 3.5274

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