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Specification
Brand : Chip Quik
BulletPoint : Solder Paste
ExternallyAssignedProductIdentifier1 : 0708210644808
ExternallyAssignedProductIdentifier2 : 708210644808
ItemName : Chip Quik SMDAL10 Aluminum Solder Paste Water-Soluble Sn96.5/Ag3.5 T3 (10cc/25g syringe)
ItemPackageDimensions_Height : 14.5 centimeters
ItemPackageDimensions_Length : 3 centimeters
ItemPackageDimensions_Width : 10.6 centimeters
ItemTypeKeyword : solder
Manufacturer : Chip Quik®
Material : metal
ModelNumber : SMDAL10
PartNumber : SMDAL10
ProductDescription : Lead-Free / RoHS 3 Compliant / REACH Compliant Description Chip Quik Aluminum Soldering Paste Water-Soluble Lead-Free in 10cc syringe 25g w/plunger & tip. Use to solder Aluminum Heat Sinks to printed circuit boards. For soldering Aluminum to Aluminum, Copper, and Nickel Coated Aluminum. Specifications Alloy: Sn96.5/Ag3.5 Flux Type: Synthetic Water-Soluble Flux Classification: ROM1 (Water Soluble, Must be cleaned off post-use using Hot Water (60C+) or IPA) Metal Content: 75% metal by weight. Particle Size: T3 (25-45 microns) Melting Point: 221C (430F) Size: 10cc/25g syringe Shelf Life Refrigerated >12 months, unrefrigerated >6 months Stencil Life >12 hours @ 20-50% RH 22-28C (72-82F) >4 hours @ 50-70% RH 22-28C (72-82F) Stencil Cleaning Automated stencil cleaning systems for both stencil and misprinted boards. Manual cleaning using isopropyl alcohol (IPA). Storage and Handling Refrigerate at 3-8C (37-46F). Do not freeze. Allow 4 hours for solder paste to reach an operating temperature of 20-25C (68-77F) before use. Transportation This product has no shipping restrictions. Shipping below 0C (32F) or above 25C (77F) for normal transit times by ground or air will not impact this product's stated shelf life.
ProductSiteLaunchDate : 2021-05-21T16:30:00.142Z
SafetyDataSheetUrl : http://www.chipquik.com/msds/SMDAL10.pdf
SupplierDeclaredDgHzRegulation : not_applicable
UnspscCode : 23271800