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Specification
Brand : Chip Quik
BulletPoint : Lead-Free / RoHS Compliant
BulletPoint1 : Pre-Fluxed Precision: Precise application, perfect for soldering intricate jewelry designs such as rope chains, hollow shells, findings, earring posts, and jump rings.
BulletPoint2 : Eliminates Waste: The convenient dispensing syringes blend solder powder, flux, and binder, enabling the use of the exact amount required, which eliminates waste and enhances the appearance of the joint area.
BulletPoint3 : Includes Spare Tips: Each package includes two spare applicator tips, ensuring that you always have the tools needed for precise and efficient application.
BulletPoint4 : Optimal Melting Point: With a melting temperature of 1450°F (787.7°C) this solder paste is ideal for achieving strong and durable joints in your jewelry pieces.
BulletPoint5 : High-Quality and Safe: Made in the USA, this cadmium-free soft silver solder paste (SS65) meets high safety standards, ensuring the quality and safety of your jewelry creations.
ExternallyAssignedProductIdentifier1 : 0713807399825
ExternallyAssignedProductIdentifier2 : 713807399825
ItemName : Chip Quik SMD291SNL250T3 Solder Paste in jar 250g (T3) SAC305 no clean
ItemPackageDimensions_Height : 6.5 centimeters
ItemPackageDimensions_Length : 5.5 centimeters
ItemPackageDimensions_Width : 6.2 centimeters
ItemPackageQuantity : 1
ItemShape : Wire
ItemTypeKeyword : solder
Manufacturer : Chip Quik®
Material : Solder Paste
Material1 : Zinc
Material2 : Tin
MeasurementSystem : Inch
ModelNumber : SMD291SNL250T3
NumberOfItems : 1
PartNumber : SMD291SNL250T3
ProductDescription : Description Solder Paste in jar 250g (T3) SAC305 no clean 88.5% metal. Alloy: Sn96.5/Ag3.0/Cu0.5 Flux Type: Synthetic No-Clean Flux Classification: REL0 Metal Content: 88.5% metal by weight. Particle Size: T3 (25-45 microns) Melting Point: 217-220C (423-428F) Size: 250g jar Shelf Life Refrigerated >6 months, unrefrigerated >2 months Stencil Life >8 hours @ 20-50% RH 22-28C (72-82F) >4 hours @ 50-70% RH 22-28C (72-82F) Stencil Cleaning Automated stencil cleaning systems for both stencil and misprinted boards. Manual cleaning using isopropyl alcohol (IPA). Storage and Handling Refrigerate at 3-8C (37-46F). Do not freeze. Allow 4 hours for solder paste to reach an operating temperature of 20-25C (68-77F) before use. Transportation This product has no shipping restrictions. Shipping below 0C (32F) or above 25C (77F) for normal transit times by ground or air will not impact this product's stated shelf life.
ProductSiteLaunchDate : 2013-12-28T17:45:49.977Z
SafetyDataSheetUrl : http://www.chipquik.com/msds/SMD291SNL250T3.pdf
Size : 0.3mm
StreetDate : 2017-12-15T00:00:01Z
SupplierDeclaredDgHzRegulation : not_applicable
UnitCount : 1
Voltage : 1 volts