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Specification
Brand : Chip Quik
BulletPoint : Solder Wire
ExternallyAssignedProductIdentifier1 : 0708210654333
ExternallyAssignedProductIdentifier2 : 708210654333
ItemDisplayWeight : 100 grams
ItemName : Chip Quik RMA591SNPBBI-100S RMA Solder Paste Sn43/Pb43/Bi14 T4 (100g Syringe)
ItemPackageDimensions_Height : 16.1 centimeters
ItemPackageDimensions_Length : 3.4 centimeters
ItemPackageDimensions_Width : 6.8 centimeters
ItemPackageQuantity : 1
ItemTypeKeyword : solder
Manufacturer : Chip Quik®
Material : metal
ModelNumber : RMA591SNPBBI-100S
NumberOfItems : 25
PartNumber : RMA591SNPBBI-100S
ProductDescription : RMA Solder Paste Tin/Lead/Bismuth (Sn43/Pb43/Bi14) Specifications Alloy: Sn43/Pb43/Bi14 Flux Type: Synthetic RMA Flux Classification: ROL0 Metal Content: 87% metal by weight. Particle Size: T4 (20-38 microns) Melting Point: 144-163C (291-325F) Size: 100g/30cc syringe Shelf Life Refrigerated >12 months, unrefrigerated >6 months Stencil Life >8 hours @ 20-50% RH 22-28C (72-82F) >4 hours @ 50-70% RH 22-28C (72-82F) Stencil Cleaning Automated stencil cleaning systems for both stencil and misprinted boards. Manual cleaning using isopropyl alcohol (IPA). Storage and Handling Refrigerate at 3-8C (37-46F). Do not freeze. Allow 4 hours for solder paste to reach an operating temperature of 20-25C (68-77F) before use. Transportation This product has no shipping restrictions. Shipping below 0C (32F) or above 25C (77F) for normal transit times by ground or air will not impact this product's stated shelf life.
ProductSiteLaunchDate : 2022-02-03T20:23:25.077Z
SafetyDataSheetUrl : http://www.chipquik.com/msds/RMA591SNPBBI-100S.pdf
SupplierDeclaredDgHzRegulation : not_applicable
UnitCount : 400