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Specification
Brand : Chip Quik
BulletPoint : Solder Wire
BulletPoint1 : Please read descriptions carefully before ordering.
BulletPoint2 : Please do not hesitate to contact the seller if you need additional details of this product.
BulletPoint3 : They are quite small and can transmit electronic .
BulletPoint4 : There are many different sizes you can choose, and you can choose 9 bottles to get them all.
BulletPoint5 : These tin balls are used for connection of semiconductor chip, circuit module and PCB board.
Color : 0.8mm 100g
CustomerPackageType : Standard Packaging
ExternallyAssignedProductIdentifier1 : 0708210649919
ExternallyAssignedProductIdentifier2 : 708210649919
ItemDisplayDimensions_Height : 0.13 inches
ItemDisplayWeight : 0.22 pounds
ItemName : Chip Quik NC4SW.031 1LB Solder Wire 93.5/5/1.5 Lead/Tin/Silver No-Clean .031 1lb
ItemPackageDimensions_Height : 2 inches
ItemPackageDimensions_Length : 2 inches
ItemPackageDimensions_Width : 2 inches
ItemTypeKeyword : solder
Manufacturer : Chip Quik®
Material : lead
ModelName : JTLB5saex91wbf-06
ModelNumber : NC4SW.031 1LB
NumberOfBoxes : 1
NumberOfItems : 1
PartNumber : NC4SW.031 1LB
ProductDescription : Kester 979 VOC-Free No-Clean 5 Gallon Kester 979 is a VOC-free no-clean flux formulation for high quality low-defect soldering of electronic circuit board assemblies. This flux’s finely tuned activation system offers the best wetting available in VOC-Free liquid flux technology and the shiniest solder joints. Kester 979 also reduces micro solderballing on glossy laminates and between connector pins. Kester 979 will not attack properly cured solder masks or FR-4 Epoxy-Glass laminate. Kester 979 leaves a minimal amount of residue after soldering. All remaining residues are non-corrosive non-conductive and do not need to be removed. 979
ProductSiteLaunchDate : 2021-06-02T13:47:09.414Z
SafetyDataSheetUrl : http://www.chipquik.com/msds/NC4SW.031 1LB.pdf
Size : 0.5mm
SupplierDeclaredDgHzRegulation : not_applicable
UnitCount : 1
UnspscCode : 23271800