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Specification
Brand : Chip Quik
BulletPoint : Solder Paste
BulletPoint1 : ¡¾Features¡¿Environmentally friendly ?, refined materials, strengthened solder ball soldering capabilities.
BulletPoint2 : ¡¾Performance¡¿Ultra?small ball?shaped tin electronic parts, which can transmit electronic .
BulletPoint3 : ¡¾Description¡¿The diameter of the solder ball with IC packaging is approx. 0.2?0.76mm/0.008?0.03in.
BulletPoint4 : ¡¾Professional design¡¿Trace elements added to the solder balls to improve the oxidation ability and reliability of the solder balls.
BulletPoint5 : ¡¾Widely Used¡¿ Widely used in connecting semiconductor chips, circuit templates, PCB boards, and transmit electronic .
ExternallyAssignedProductIdentifier1 : 0708210651608
ExternallyAssignedProductIdentifier2 : 708210651608
FinishType : Finish
Hazmat : auto-grounding
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IncludedComponents2 : inc
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ItemName : Chip Quik NC191LTA35T5 Smooth Flow Low Temp Solder Paste Sn42/Bi57/Ag1 T5 35g Syringe
ItemPackageDimensions_Height : 12.4 centimeters
ItemPackageDimensions_Length : 1.9 centimeters
ItemPackageDimensions_Width : 7.8 centimeters
ItemPackageQuantity : 1
ItemTypeKeyword : solder
Manufacturer : Chip Quik®
Material : metal
Material1 : Material
Material2 : Material
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Material4 : Material
Material5 : Material
ModelNumber : NC191LTA35T5
PartNumber : NC191LTA35T5
PowerSourceType : PowerSource
ProductDescription : Lead-Free / RoHS 3 Compliant / REACH Compliant Description Smooth FlowTM Technology Developed with a lower density flux vehicle for better shear spread and improved flow during heating Halogen Free (EN14582 test method) Specifications Alloy: Sn42/Bi57/Ag1 Flux Type: Synthetic No-Clean Flux Classification: ROL0 Metal Content: 85.75% metal by weight. Particle Size: T5 (15-25 microns) Melting Point: 137C (279F) Size: 10cc/35g syringe Shelf Life Refrigerated >12 months, unrefrigerated >6 months Stencil Life >8 hours @ 20-50% RH 22-28C (72-82F) >4 hours @ 50-70% RH 22-28C (72-82F) Stencil Cleaning Automated stencil cleaning systems for both stencil and misprinted boards. Manual cleaning using isopropyl alcohol (IPA). Storage and Handling Refrigerate at 3-8C (37-46F). Do not freeze. Allow 4 hours for solder paste to reach an operating temperature of 20-25C (68-77F) before use. Transportation This product has no shipping restrictions. Shipping below 0C (32F) or above 25C (77F) for normal transit times by ground or air will not impact this product's stated shelf life.
ProductSiteLaunchDate : 2021-06-01T16:10:28.233Z
SafetyDataSheetUrl : http://www.chipquik.com/msds/NC191LTA35T5.pdf
SupplierDeclaredDgHzRegulation : not_applicable
UnitCount : 1