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Specification
Brand : Chip Quik
BulletPoint1 : Smooth Flow
BulletPoint2 : Low Temp Solder
BulletPoint3 : Halogen Free
BulletPoint4 : Lead-free
BulletPoint5 : RoHS Compliant
ExternallyAssignedProductIdentifier1 : 708210651691
ExternallyAssignedProductIdentifier2 : 0708210651691
Hazmat : 3
ItemDisplayDimensions_Height : 2 inches
ItemDisplayWeight : 250 grams
ItemForm : Liquid
ItemName : Chip Quik NC191LT250 Smooth Flow Low Temp Solder Paste Sn42/Bi57.6/Ag0.4 T4 250g Jar
ItemPackageDimensions_Height : 5.8 centimeters
ItemPackageDimensions_Length : 5.6 centimeters
ItemPackageDimensions_Width : 5.8 centimeters
ItemPackageQuantity : 1
ItemTypeKeyword : solder
Manufacturer : Chip Quik®
Material : lead, metal
ModelName : 247-REMALLOY4.5-LF
ModelNumber : NC191LT250
NumberOfItems : 1
PartNumber : NC191LT250
ProductDescription : Smooth FlowTM Technology Developed with a lower density flux vehicle for better shear spread and improved flow during heating Halogen Free (EN14582 test method) Specifications Alloy: Sn42/Bi57.6/Ag0.4 Flux Type: Synthetic No-Clean Flux Classification: ROL0 Metal Content: 89.75% metal by weight. Particle Size: T4 (20-38 microns) Melting Point: 138C (281F) Size: 250g jar Shelf Life Refrigerated >6 months, unrefrigerated >2 months Stencil Life >8 hours @ 20-50% RH 22-28C (72-82F) >4 hours @ 50-70% RH 22-28C (72-82F) Stencil Cleaning Automated stencil cleaning systems for both stencil and misprinted boards. Manual cleaning using isopropyl alcohol (IPA). Storage and Handling Refrigerate at 3-8C (37-46F). Do not freeze. Allow 4 hours for solder paste to reach an operating temperature of 20-25C (68-77F) before use. Transportation This product has no shipping restrictions. Shipping below 0C (32F) or above 25C (77F) for normal transit times by ground or air will not impact this product's stated shelf life.
ProductSiteLaunchDate : 2020-10-08T16:52:19.307Z
SafetyDataSheetUrl : https://www.chipquik.com/msds/NC191LT250.pdf
SupplierDeclaredDgHzRegulation : not_applicable