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Specification
Brand : Chip Quik
BulletPoint : Solder Wire
BulletPoint1 : Smooth Flow
BulletPoint2 : Sn63/Pb37
BulletPoint3 : Halogen Free
BulletPoint4 : T4
ExternallyAssignedProductIdentifier1 : 708210651776
ExternallyAssignedProductIdentifier2 : 0708210651776
GpsrSafetyAttestation : 1
ItemDisplayDimensions_Height : 2 inches
ItemDisplayWeight : 250 grams
ItemName : Chip Quik NC191AX250 Smooth Flow Leaded Solder Paste Sn63/Pb37 T4 250g Jar
ItemPackageDimensions_Height : 5.6 centimeters
ItemPackageDimensions_Length : 5.6 centimeters
ItemPackageDimensions_Width : 5.6 centimeters
ItemTypeKeyword : solder
Manufacturer : Chip Quik®
Material : metal
ModelNumber : NC191AX250
PartNumber : NC191AX250
ProductDescription : Smooth FlowTM Technology Developed with a lower density flux vehicle for better shear spread and improved flow during heating Halogen Free (EN14582 test method) Specifications Alloy: Sn63/Pb37 Flux Type: Synthetic No-Clean Flux Classification: ROL0 Metal Content: 90% metal by weight. Particle Size: T4 (20-38 microns) Melting Point: 183C (361F) Size: 250g jar Shelf Life Refrigerated >12 months, unrefrigerated >6 months Stencil Life >8 hours @ 20-50% RH 22-28C (72-82F) >4 hours @ 50-70% RH 22-28C (72-82F) Stencil Cleaning Automated stencil cleaning systems for both stencil and misprinted boards. Manual cleaning using isopropyl alcohol (IPA). Storage and Handling Refrigerate at 3-8C (37-46F). Do not freeze. Allow 4 hours for solder paste to reach an operating temperature of 20-25C (68-77F) before use. Transportation This product has no shipping restrictions. Shipping below 0C (32F) or above 25C (77F) for normal transit times by ground or air will not impact this product's stated shelf life.
ProductSiteLaunchDate : 2020-10-05T17:31:02.790Z
SafetyDataSheetUrl : https://www.chipquik.com/msds/NC191AX250.pdf
SupplierDeclaredDgHzRegulation : not_applicable
UnspscCode : 23271800