Cart 2 india

Specification
Brand : Walfront
BulletPoint1 : ¡¾Features¡¿Environmentally friendly ?, refined materials, strengthened solder ball soldering capabilities.
BulletPoint2 : ¡¾Performance¡¿Ultra?small ball?shaped tin electronic parts, which can transmit electronic .
BulletPoint3 : ¡¾Description¡¿The diameter of the solder ball with IC packaging is approx. 0.2?0.76mm/0.008?0.03in.
BulletPoint4 : ¡¾Professional design¡¿Trace elements added to the solder balls to improve the oxidation ability and reliability of the solder balls.
BulletPoint5 : ¡¾Widely Used¡¿ Widely used in connecting semiconductor chips, circuit templates, PCB boards, and transmit electronic .
ExternallyAssignedProductIdentifier1 : 0769471394086
ExternallyAssignedProductIdentifier2 : 769471394086
FinishType : Finish
Hazmat : auto-grounding
IncludedComponents1 : inc
IncludedComponents2 : inc
IncludedComponents3 : inc
IncludedComponents4 : inc
IncludedComponents5 : inc
IncludedComponents6 : inc
IncludedComponents7 : inc
IncludedComponents8 : inc
IncludedComponents9 : inc
ItemName : BGA ? Solder Balls PCB boards 0.4mm Tin Sphere 25W Soldering Reballing Accessories
ItemPackageDimensions_Height : 10.9 centimeters
ItemPackageDimensions_Length : 4 centimeters
ItemPackageDimensions_Width : 8 centimeters
ItemPackageQuantity : 1
ItemTypeKeyword : solder
Manufacturer : Walfront
Material : copper
Material1 : Material
Material2 : Material
Material3 : Material
Material4 : Material
Material5 : Material
PartNumber : Walfrontgbq3er9zh8
PowerSourceType : PowerSource
ProductDescription : Specification:
Conditon: 100% Brand New
Item Type: ? Solder Ball
Material: Sn96.5% / Ag3% / Cu0.5%
Specification: Approx.0.4mm / 0.016in 250,000 grains
Application: Suitable for Chip BGA reballing, BGA package soldering, filling, maintenance

Package List:
1 x Bottle of Tin Balls

ProductSiteLaunchDate : 2020-10-13T00:00:00.000Z
SupplierDeclaredDgHzRegulation : not_applicable
UnitCount : 1