Specification Brand : Walfront BulletPoint : Solder Bar BulletPoint1 : DURABLE TIN MATERIAL: This solder ball is made of good quality tin material, stable, durable and can be used for a long time BulletPoint2 : CONNECT CHIPS AND PCB: These solder balls are used to connect semiconductor chips, circuit modules and PCB boards, provide great convenience BulletPoint3 : TRANSMIT FOR WELDING: Tin solder balls are very small, can transmit electronic , very useful for welding work BulletPoint4 : ENOUGH QUANTITY: Available in many different sizes, each bottle contains approximately 12,500 solder balls to meet your basic soldering needs BulletPoint5 : STABLE AND DURABLE: Tin solder ball for BGA reballing come with stable structure, excellent performance and long service life Color : Sn63pb37 100g ExternallyAssignedProductIdentifier1 : 037103360120 ExternallyAssignedProductIdentifier2 : 0037103360120 FinishType : Polished IncludedComponents : Solder wire ItemForm : Coil ItemName : 7 Bottles Tin Solder Ball Tin Solder Ball BGA Reballing Tin Solder Ball BGA Reballing Soldering Heat Universal Stencils for PCB Chip 0.25, 0.3, 0.35, 0.4, 0.45, 0.5, 0.6mm ItemPackageDimensions_Height : 12.1 centimeters ItemPackageDimensions_Length : 3.8 centimeters ItemPackageDimensions_Width : 10.4 centimeters ItemPackageQuantity : 1 ItemShape : Round Rod ItemTypeKeyword : solder Manufacturer : WALFRONT Material : tin ModelName : WALFRONTkb48p3oi1x ModelNumber : WALFRONTkb48p3oi1x NumberOfBoxes : 1 NumberOfItems : 1 PackageLevel : unit PartNumber : WALFRONTkb48p3oi1x PowerSourceType : hand_powered ProductDescription : Specification: Item Type: Tin Solder Ball Material: Tin Specifications: 0.25, 0.3, 0.35, 0.4, 0.45, 0.5, 0.6mm Application: Tin balls are mainly used to connect semiconductor chips, circuit templates and PCB boards, and ultra small spherical tin electronic parts that transmit electronic