2-Layer Double-Sided Flexible Copper-Clad Laminate(Cu18?m/TPI25?m/Cu18?m x 9.8in)-5m-High Conductivity & Flexibility, Wearable Devices, and Automotive Electronics, 5G Circuit Board (1, 5m)

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₹ 20900/-

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Product Information


Specification
Brand : CIVEN METAL
BulletPoint1 : Exceptional Performance: Featuring a robust construction of 18μm copper (Cu) combined with a 25μm Thermal Paper Insulation (TPI) layer, our Copper Clad Laminate ensures unparalleled performance for various applications, particularly in 5G technologies.
BulletPoint2 : Versatile Size: Measuring 250mm x 5m, this laminate offers generous material for a wide range of projects, making it the perfect choice for electronics, wearable devices, automotive electronics, and advanced 5G circuit board applications.
BulletPoint3 : Superior Conductivity: With its outstanding conductivity and flexibility, our Copper Clad Laminate enables intricate designs and enhances functionality, catering to the evolving demands of cutting-edge technology and high-performance applications.
BulletPoint4 : Ideal for High-Tech Projects: Whether developing next-generation wearable devices or automotive components, this flexible laminate is engineered to meet the rigorous standards of modern technological applications, ensuring reliability and durability.
BulletPoint5 : Specification: Measuring 250mm x 5m, 18μm copper (Cu), 25μm Thermal Paper Insulation (TPI), One roll per box
Color : Copper
ItemForm : Cu
ItemName : 2-Layer Double-Sided Flexible Copper-Clad Laminate(Cu18μm/TPI25μm/Cu18μm x 9.8in)-5m-High Conductivity & Flexibility, Wearable Devices, and Automotive Electronics, 5G Circuit Board (1, 5m)
ItemPackageDimensions_Height : 0.39 inches
ItemPackageDimensions_Length : 2.17 inches
ItemPackageDimensions_Width : 2.17 inches
ItemPackageQuantity : 1
ItemShape : Roll
ItemTypeKeyword : copper-sheets
Manufacturer : CIVEN METAL
Material : Cu
ModelNumber : 1P438LEC3BV30B06D8F1
NumberOfItems : 1
NumberOfLithiumMetalCells : 1
PartNumber : Copper-Clad Laminate
ProductDescription : This laminate features a robust construction of Cu (Copper) at 18μm, combined with a TPI (Thermal Paper Insulation) layer of 25μm, ensuring exceptional performance and reliability. With a generous size of 250mm x 5m, this product provides ample material for a variety of projects, making it the ideal choice for electronics, wearable devices, automotive electronics, and particularly 5G circuit board applications. Copper Clad Laminate boasts superior conductivity and flexibility, allowing for intricate designs and enhanced functionality in cutting-edge technology. Whether you are developing next-generation wearable devices or high-performance automotive components, you can trust this flexible laminate to meet your demanding requirements.
ProductSiteLaunchDate : 2024-08-30T07:28:07.108Z
Size : 5m
SupplierDeclaredDgHzRegulation : not_applicable
SupplierDeclaredHasProductIdentifierExemption : 1

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