28 IN 1 CPU Disassemble Maintenance For Phone NAND CHIP IC Remove Rework Maintenance

Imported from USA | Ships in 10 working days

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1

₹ 3100/-

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Product Information


Specification
Brand : URTERYSER
BulletPoint1 : For BGA repair,dismantling phone CPU chip and phone repair.
BulletPoint2 : handle and 27pcs in different
BulletPoint3 : It can be used to separate the welding
BulletPoint4 : 28 in 1 Repaired CPU A10 Motherboard Burin to Remove Phone Processors For IC Chip Repair Thin
BulletPoint5 : Proffesional repair tool set for CPU disassemble.
Color : A
ExternallyAssignedProductIdentifier : 7625940153192
ItemName : 28 IN 1 CPU Disassemble Maintenance For Phone NAND CHIP IC Remove Rework Maintenance
ItemPackageDimensions_Height : 4 centimeters
ItemPackageDimensions_Length : 23 centimeters
ItemPackageDimensions_Width : 16 centimeters
ItemTypeKeyword : computer-and-mobile-device-repair-kits
ItemTypeName : Repair Tapes
Manufacturer : URTERYSER
ModelName : IGYWYNty6izfmdrh
ModelNumber : IGYWYNty6izfmdrh
PartNumber : URTERYSER
ProductDescription : 28 IN 1 CPU Disassemble Maintenance For Phone NAND CHIP IC Remove Rework maintenance
Features:
Brand new and
28 in 1 Repaired CPU A10 Motherboard Burin to Remove Phone Processors For IC Chip Repair Thin
handle and 27pcs in different
Proffesional repair tool set for CPU disassemble.
For BGA repair,dismantling phone CPU chip and phone repair.
It can be used to separate the welding

Specifications:
Steel, Aluminum
Length: 130 mm
Color: ,Green(optional)

Package Includes:
1 x Handle
27 x

Note:
Due to the different monitor and light effect, the actual color of the item might be slightly different from the color showed on the pictures. Thank you!
Please allow 1-3mm measuring deviation due to manual measurement.
ProductSiteLaunchDate : 2024-04-27T00:37:09.000Z
UnitCount : 1

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