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Specification
Brand : ENGINEER
BulletPoint1 : ENGINEER SWS-06 Non-cleaning type high-performance solder with solder that pursues high reliability of solder joints
BulletPoint2 : The activity lasts for a long time, and the excellent spread rate and the wettability of the solder make the work faster.
BulletPoint3 : Since the flux residue is completely non-corrosive, there is no need to clean the substrate after soldering.
BulletPoint4 : The residue is extremely non-conducting and non-hygroscopic, and is ideal for high-density mounting substrates without the occurrence of aging defects.
BulletPoint5 : Uses organic amine-based special active rosin (non-chlorine). Compatible with JIS-AA class and MIL-RMA standard.
Color : For Use With Copper and Copper Alloy Precision Substrates
ExternallyAssignedProductIdentifier : 4989833041069
GpsrSafetyAttestation : 1
IncludedComponents : No
ItemName : ENGINEER SWS-06 Superiot RMA Copper/Copper Alloy Precision Substrate Solder 0.6mm × 5.6m
ItemPackageDimensions_Height : 12.1 centimeters
ItemPackageDimensions_Length : 3.1 centimeters
ItemPackageDimensions_Width : 9.4 centimeters
ItemPackageQuantity : 1
ItemTypeKeyword : solder
Manufacturer : エンジニア(ENGINEER)
Material : Sn60%, Pb40%
ModelName : Superior RMA / Unwashed Solder
ModelNumber : SWS-06
NumberOfBoxes : 1
NumberOfItems : 1
PartNumber : SWS-06
PowerSourceType : hand_powered
ProductDescription :

BEEYUIHF #7142 solder flux paste has a high viscosity, similar to butter in appearance, and contains rosin, which makes the solder and the soldering surface fully moisturized. The use of flux paste can greatly improve the soldering process and efficiency.

Soldering recommended soldering iron operating temperature: 210-230 ° C (410-446 ° F), when we are soldering, soldering flux will be melted than the solder material first, quickly covered in the solder surface, so that it plays a role in preventing the oxidation of the metal surface, and can be at a higher temperature and the surface of the oxidized film of the reaction of the surface of the solder, so that it is melted, to restore the pure surface of the metal.

Solder paste flux prevent re-oxidation of surfaces during soldering, reduce solder surface tension and improve soldering performance. #7142 The primary function of flux is to remove oxides from the surface of the solder and the base metal being soldered to achieve the necessary cleanliness of the metal surface.

Semi solid soldering paste flux is not easy to pour, produces a stronger connection - Flux allows the solder to bond properly over the entire target area.

Solder paste flux in paste form reduces the temperature required for soldering, minimizes thermal deformation and stress in the soldered metal, and improves the strength and reliability of the soldered joint. In order to ensure the quality of soldering, it is necessary to choose the right soldering flux.

ProductSiteLaunchDate : 2012-08-17T05:51:45.084Z
Size : 線径:0.6㎜
Style : 15g
SupplierDeclaredDgHzRegulation : not_applicable
SupplierDeclaredHasProductIdentifierExemption : 1
UnitCount : 1
UnspscCode : 23271800