Electronic Potting Compound -High Thermal Conductivity -Insulate & Waterproof Circuits, Underwater & Underground -Permanent Hide Proprietary Design, Large Casting, MAX EPC

Customer rating 4.2 stars

Imported from USA | Ships in 10 working days

5% additional discount on UPI | Cash On Delivery available

1

₹23190 -31% ₹16000/-

The price at cart2india.com is inclusive of custom duties, GST, freight forwarding and other charges.

Free Shipping across India. Powered by BlueDart.
EMI and GST Invoice available.

Product Information


Specification
Brand : The Epoxy Experts, MAX EPOXY SYSTEMS
BulletPoint : Jobber Drill,23/64"",HSS -6 pack
BulletPoint1 : Epoxy Potting Compound, Thermally Conductive For Fast Heat Dissipation
BulletPoint10 : Hole Filler
BulletPoint2 : Large Volume, Thick Cross-Section, Low Exothermic Heat Generation
BulletPoint3 : Lower Viscosity Compared To Other Thermally Conductive Potting Compound
BulletPoint4 : Insulates AC/DC Current, Suitable For High And Low Voltage Insulating
BulletPoint5 : Long Working Time - Cures In 24 Hours @ 25°C -Heat Curable For Faster Cure
BulletPoint6 : Void Filler For Wood, Concrete And Metal
BulletPoint7 : Dimensionally Stable Casting Resin
BulletPoint8 : Opaque Black Permanent Masking
BulletPoint9 : Thermally Conductive Epoxy
Color : Black
CompatibleMaterial1 : Plastic
CompatibleMaterial2 : Acrylic
CompatibleMaterial3 : Ceramic
CompatibleMaterial4 : Concrete
CompatibleMaterial5 : Wood
CuttingAngleString : 118.0 degrees
ExternallyAssignedProductIdentifier : 4913263162988
ExternallyAssignedProductIdentifier1 : 0703313207585
ExternallyAssignedProductIdentifier2 : 703313207585
FinishType : Uncoated
ItemForm1 : Liquid
ItemForm2 : Gel
ItemName : Electronic Potting Compound -High Thermal Conductivity -Insulate & Waterproof Circuits, Underwater & Underground -Permanent Hide Proprietary Design, Large Casting, MAX EPC
ItemPackageQuantity : 1
ItemTypeKeyword : industrial-lubricants
ItemVolume : 89 fluid_ounces
Manufacturer : Polymer Composites, Inc.
Material1 : Epoxy Resin
Material10 : Dimensionally Stable Casting Resin
Material2 : Potting Compound
Material3 : None Electrically Conductive
Material4 : Thermally Conductive For Heat Sink Application
Material5 : Suitable For Large Potting Without High Heat Release
Material6 : Epoxy Hole FIller
Material7 : Epoxy Resin Void Filler
Material8 : Themally Conductive
Material9 : Underwater Potting Compound
ModelNumber : MAX EPC A/B
PartNumber : MAXEPC80OZ
ProductDescription :

MAX EPC A/B is a room-temperature cured epoxy-based electronic potting compound designed for large mass potting or encapsulation of printed circuit boards & circuits. MAX EPC A/B is designed to cure slowly for large potting volumes, up to 89 fluid ounces or 2.63 liters. The exothermic heat produced is not enough to produce a "runaway" reaction during cure. MAX EPC is filled with thermally conductive fillers that wick heat away and allow faster cooling.

MAX EPC A/B is mixed 4:1 by weight; it provides a 90-minute working time for volumes of 3 cubic inches & up to 45 minutes for larger mass -up to 6 cubic inches without generating high exothermic heat. 

Its mixed viscosity is 3800 cPs at 25°C, similar to the consistency of syrup or honey. It is poured into place and self-levels in less than 20 minutes. MAX EPC A/B is designed to release air bubbles and cure void-free.

Upon cure, MAX EPC is electrically non-conductive and provides a permanent barrier against air, corrosive environments, moisture, and direct physical contact with the circuitry. MAX EPC's high thermal conductivity prevents heat build-up by dissipating heat energy more efficiently.

MAX EPC A/B bonds to metals, FRP, ABS, PVC, Plastisol, and other plastic compounds used in wire jacketing and electrical enclosures.

MAX EPC is opaque black, offering permanent masking of proprietary circuits & components.
MAX EPC is tough and impact-resistant and demonstrates high compressive strength and resistance to acids, bases, and most solvents and fuels.

MIX RATIO: 4:1 By Weight
WORKING TIME: 90 Minutes @ 25°C
CURE TIME: 48 Hrs @ 25°C
ACCELERATED CURE: 2 Hours @ 100°C
HARDNESS: 85 Shore D
VOLUME RESISTIVITY: 1 x 10 exp16 Ω/CM
DIELECTRIC STRENGTH: 500V/mil
THERMAL CONDUCTIVITY:0.72 W/(m•K)
SERVICE TEMPERATURE: -20°C to 110°C


ProductSiteLaunchDate : 2019-03-15T07:00:00.000Z
Size : 89 Fluid Ounce Combined Volume 160.6 Cubic Inches
SpecificGravity : 1.57 grams_per_cubic_centimeter
SpecificUsesForProduct1 : Craft
SpecificUsesForProduct2 : Electronic Potting
SpecificUsesForProduct3 : Void FIlling
SpecificUsesForProduct4 : Thermally Conductive Potting Compound
SpecificUsesForProduct5 : Dimesionally Stable Casting Resin
Style : 89 Fluid Ounce Kit
TemperatureRatingDegrees : 300 degrees_fahrenheit
TensileStrength : 9900 pounds_per_square_inch
UnitCount : 89
UnspscCode : 31200000
Viscosity : 4100 centipoise
WaterResistanceLevel : waterproof

Questions & Answers

Have a question? Ask experts

?
No question found

Ratings & Review

Rating Breakdown (average)

5*
4
4*
3
3*
2
2*
0
1*
0

Read all 9 customer reviews

Stunning design and excellent performance.

Meets basic needs, not exceptional.

Truly exceeded my expectations.

This product exceeded some of my expectations.

Everything about this is perfect.

It's usable but lacks some key features.

High quality and great value.

Very useful and nicely packaged.

Great choice for daily use.

Have an opinion on this page? Let's hear it.