2Pcs Ultra Thin 0.01mm Insulation Copper Soldering Wire Compatible with iPhone Motherboard BGA Fingerprint Repair Tool

Imported from USA | Ships in 10 working days

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1

₹ 3800/-

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Product Information


Specification
Brand : Louishy
BulletPoint1 : Professional copper soldering wire with ultra-fine diameter of 0.01mm.
BulletPoint2 : Precise connection, ensure there is no short-circuit between 0.1mm solder joints.
BulletPoint3 : It can be used to connect jump wire for computer and phone motherboard repair.
BulletPoint4 : No need to remove the lacquer, welding directly.
BulletPoint5 : Material: Copper; Diameter: 0.01mm; Full Length: 60m
Color : Black+red
IncludedComponents : 2 Roll x 0.01mm Copper Soldering Wire for BGA Repair
ItemName : 2Pcs Ultra Thin 0.01mm Insulation Copper Soldering Wire Compatible with iPhone Motherboard BGA Fingerprint Repair Tool
ItemPackageDimensions_Height : 3.94 inches
ItemPackageDimensions_Length : 17.32 inches
ItemPackageDimensions_Width : 13.39 inches
ItemTypeKeyword : esd-tool-sets
Manufacturer : Louishy
Material : Copper
ModelName : 4iiFy_dvQLddAmZ9AR8wFQN4x8F
ModelNumber : Copper soldering wire
NumberOfBoxes : 1
NumberOfItems : 2
PartNumber : 1
PowerSourceType : ac
ProductDescription : 2Pcs Ultra Thin 0.01mm Insulation Copper Soldering Wire Compatible with iPhone Motherboard BGA Fingerprint Repair Tool
ProductSiteLaunchDate : 2024-09-05T08:35:14.812Z
Size : 0.02mm
SupplierDeclaredDgHzRegulation : not_applicable
SupplierDeclaredHasProductIdentifierExemption : 1
UnitCount : 1
UnspscCode : 27111700

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