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Product Information
Specification
CompatibleMaterial : Metal
ItemForm : Paste
ItemName : Aremco-Bond 805 Epoxy for Bonding and Molding Applications, Gallon
ItemPackageQuantity : 1
ItemTypeKeyword : conductive-adhesives
Manufacturer : Graphtek
Material : Resin
ModelNumber : ARMC-805
PartNumber : 805
ProductDescription : Aremco-Bond 805 is an aluminum-filled, two-component (resin:hardener) epoxy paste for specialty bonding, molding and potting applications to 570°F (300°C). Provides low shrinkage, high thermal conductivity and excellent mechanical strength.
Aremco-Bond 805 should be mixed thoroghly in 100:12 ratio (by weight) to a uniform consistency. Requires curing for 2 hours at 100°F and then for 2 more hours at 200°F (recommended) or for 24 hours at room temperature plus 2 hours at 200°F. In most cases, the epoxy should be applied to both surfaces maintaining a glue line of less than 10 mils.
On the picture Aremco-Bond 805 bonds aluminum heat sink to a power semiconductor device.
ProductSiteLaunchDate : 2013-10-31T19:58:04.653Z
SupplierDeclaredDgHzRegulation : unknown
UnitCount : 1.76
UnspscCode : 31201600
