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Specification
ItemForm : Paste
ItemName : Aremco-Bond 556-HT-SP Screen Printable Adhesive, 50gram
ItemPackageQuantity : 1
ItemTypeKeyword : conductive-adhesives
Manufacturer : Graphtek
Material : Epoxy Resin
ModelNumber : ARMC-556-HT-SP
PartNumber : 556-HT-SP
ProductDescription : Aremco-Bond 556-HT-SP is an advanced, two-part, silver-filled, screen printable, high temperature, electrically and thermally conductive adhesive used for microelectronic chip bonding, semiconductor die-attach, hybrid packaging, and other electrical and electronic assembly applications to 570°F (299°C).

Aremco-Bond 556-HT-SP mixes easily in a 1-to-1 ratio by weight and cures in 1 hour at 350°F. It comes in standard 50-gram kits but can be specially packaged in divided bi-packs or pre-mixed and frozen in syringes upon request.

Typical applications for Aremco-Bond 556-HT-SP include microelectronic chip bonding, semiconductor die-attach, hybrid packaging, and other electrical and electronic components used in connectors, lighting and sensor components.

ProductSiteLaunchDate : 2013-10-31T19:56:52.817Z
SupplierDeclaredDgHzRegulation : unknown
UnitCount : 1.76
UnspscCode : 31201600