Cart 2 india

Specification
Brand : Generic
BulletPoint : Package Includes: QFN52 , pin pitch 0.5mm | 3. Specification and Dimension : | a) Type : QFN52-0.5 | b) Pin pitch : 0.5 mm | c) Pin Count : 52 | d) Structure : Clamshell | e) Applicable IC Body Dimension : 8x8mm | Picture for your reference. Datasheet pdf is available, welcome to ask for it.
BulletPoint1 : Package Includes: BGA88 , VFBGA88 | Pin Pitch:1.0mm | Pin Count:88pins | IC Size:14*18mm | Structure:Clamshell | Material & Performance: | socket Body: PEI | Contacts:Beryllium Copper Alloy | Contact Plating:Gold over Nickel | Operation Force:2.0KG min, the more PINs the greater force. | Contact Resistance:50m max | Dielectric:700V AC for 1 minute | Insulation Resistance:1,000M 700V DC | Max Current Capacity : 1A | Temperature Rating:-55~+175 | Life Span 25,000 Times (Mechanical) | A:
BulletPoint2 : 1.Welding structure :
BulletPoint3 : Adopt traditional welding type to fix the socket and PCBA board , stable but waste time and
BulletPoint4 : effort , and once the socket is welded , it cant be recycle .
BulletPoint5 : 2.No need of welding structure :
ItemName : Wiring Connecting Terminals - BGA88 Clamshell Burn in Socket Pitch 1.0mm IC Size 14 * 18mm BGA88(14 * 18)-1.0-CP01NT BGA88 VFBGA88 Burn in Programmer Socket
ItemTypeKeyword : dip-sockets
Manufacturer : CHIKIMIKI
NumberOfItems : 1
PartNumber : CNCK795FEC7237D687DA4FB3F6223B248A32
ProductDescription : BGA88 Clamshell burn in socket pitch 1.0mm IC size 14*18mm BGA88(14*18)-1.0-CP01NT BGA88 VFBGA88 burn in programmer socket
Specifications:
Part number:BGA88(14*18)-1.0-CP01NT
IC Package includes:BGA88 , VFBGA88
Pin Pitch:1.0mm
Pin Count:88pins
IC Size:14*18mm
Structure:Clamshell
Material & Performance:
socket Body: PEI
Contacts:Beryllium Copper Alloy
Contact Plating:Gold over Nickel
Operation Force:2.0KG min, the more PINs the greater force.
Contact Resistance:50m max
Dielectric:700V AC for 1 minute
Insulation Resistance:1,000M 700V DC
Max Current Capacity : 1A
Temperature Rating:-55~+175
Life Span 25,000 Times (Mechanical)
A:Tips:
, ,please leave message to us.
Thanks.
B.BGA socket New creation
a.connect with PCB ways Innovation
Welding structure : No need of welding structure:
Way:Fix by welding Way:Fix by 4 screws
Pin length1.83mm Pin length0.25mm
Two structure Features:
1.Welding structure :
Adopt traditional welding type to fix the socket and PCBA board , stable but waste time and
effort , and once the socket is welded , it cant be recycle .
2.No need of welding structure :
Adopt innovative screws locking type to fix the sockets and PCBA board , make sure contact is
stable , meantime shorten the assembly time , time-saving and reduce effort , and socket
can be removed from the PCBA board , recycle and reduce test cost .
b.Connect with IC ways Innovation
1.Open-top/Clamshell structure
2.Accommodates pitch :4/0.5/0.65/0.8/1.0mm
3.Compact size and low Actuation Force
4.Field exchangeable package location plate
5.Ucontact support any type of solder ball shape
Ball\\\\no ball\\\\damaged ball,the drop of contact
surface is more than 0.2mm
C.HD picture to show the detailed p
ProductSiteLaunchDate : 2024-11-09T02:28:13.701Z