QFN24 MLF24 Burn in Socket IC Test Socket Pitch 0.4mm Chip Size 4x4mm Flash Adapter Clamshell for manual test with Even pad matrix QFN IC Burn in test

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Specification
Binding : Electronics
Brand : ANDK
Label : Shenzhen HongYi Electronic Technology Co., Ltd
Manufacturer : Shenzhen HongYi Electronic Technology Co., Ltd
PackageDimensions : L:7.90 X W:5.90 X H:2.00
PartNumber : QFN24-0.4-CP01G
ProductGroup : Speakers
ProductTypeName : BISS
Publisher : Shenzhen HongYi Electronic Technology Co., Ltd
SmallImage_Height : 75
SmallImage_URL : https://m.media-amazon.com/images/I/51cuZuKulaL._SL75_.jpg
SmallImage_Width : 75
Studio : Shenzhen HongYi Electronic Technology Co., Ltd
Title : QFN24 MLF24 Burn in Socket IC Test Socket Pitch 0.4mm Chip Size 4x4mm Flash Adapter Clamshell for manual test with Even pad matrix QFN IC Burn in test

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