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QFN12 MLF12 Burn in Socket IC Test Socket Pitch 0.5mm Chip Size 3x3mm Flash Adapter Clamshell Burn-in Socket with Odd pad matrix

QFN12 MLF12 Burn in Socket IC Test Socket Pitch 0.5mm Chip Size 3x3mm Flash Adapter Clamshell Burn-in Socket with Odd pad matrix

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Product Information


Specification
Binding : Electronics
Brand : ANDK
Label : Shenzhen HongYi Electronic Technology Co., Ltd
Manufacturer : Shenzhen HongYi Electronic Technology Co., Ltd
PackageDimensions : L:7.90 X W:5.90 X H:2.00
PartNumber : QFN12-0.5-CP02G
ProductGroup : Speakers
ProductTypeName : BISS
Publisher : Shenzhen HongYi Electronic Technology Co., Ltd
SmallImage_Height : 75
SmallImage_URL : https://m.media-amazon.com/images/I/41NJJp+HLSL._SL75_.jpg
SmallImage_Width : 75
Studio : Shenzhen HongYi Electronic Technology Co., Ltd
Title : QFN12 MLF12 Burn in Socket IC Test Socket Pitch 0.5mm Chip Size 3x3mm Flash Adapter Clamshell Burn-in Socket with Odd pad matrix

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