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uxcell Flat IC Chipset Thermal Copper Heatsink with Adhesive Pad for RPI,12x12x1mm 10pcs

uxcell Flat IC Chipset Thermal Copper Heatsink with Adhesive Pad for RPI,12x12x1mm 10pcs

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Product Information


Specification
Binding : Unknown Binding
Brand : uxcell
Label : uxcell
Manufacturer : uxcell
Model : a19123000ux0294
NumberOfItems : 10
PackageDimensions_Weight : 0.02866009406
PackageDimensions : L:5.1574803097 X W:3.9370078700 X H:0.5118110231
PartNumber : a19123000ux0294
ProductGroup : BISS Basic
ProductTypeName : HEAT_SINK
Publisher : uxcell
Size : 40x40x11 mm 2PCS
SmallImage_Height : 75
SmallImage_URL : https://m.media-amazon.com/images/I/41DP6kDpthL._SL75_.jpg
SmallImage_Width : 75
Studio : uxcell
Title : uxcell Flat IC Chipset Thermal Copper Heatsink with Adhesive Pad for RPI,12x12x1mm 10pcs
Weight : 0
WeightUnit : pounds

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